Datasheet

TLC27L4, TLC27L4A, TLC27L4B, TLC27L4Y, TLC27L9
LinCMOS PRECISION QUAD OPERATIONAL AMPLIFIERS
SLOS053C – OCTOBER 1987 – REVISED AUGUST 1994
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLC27L4Y chip information
These chips, when properly assembled, display characteristics similar to the TLC27L4C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
–
1OUT
1IN+
1IN–
V
DD
(4)
(6)
(3)
(2)
(5)
(1)
–
+
(7)
2IN+
2IN–
2OUT
(11)
GND
+
–
3OUT
3IN+
3IN–
(13)
(10)
(9)
(12)
(8)
–
+
(14)
4OUT
4IN+
4IN–
68
108
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)(10)
(11)
(12)(13)
(14)