Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLC27L2ACDR SOIC D 8 2500 340.5 338.1 20.6
TLC27L2AIDR SOIC D 8 2500 340.5 338.1 20.6
TLC27L2BCDR SOIC D 8 2500 340.5 338.1 20.6
TLC27L2BIDR SOIC D 8 2500 340.5 338.1 20.6
TLC27L2CDR SOIC D 8 2500 340.5 338.1 20.6
TLC27L2CPSR SO PS 8 2000 367.0 367.0 38.0
TLC27L2CPWR TSSOP PW 8 2000 367.0 367.0 35.0
TLC27L2IDR SOIC D 8 2500 340.5 338.1 20.6
TLC27L2IPWR TSSOP PW 8 2000 367.0 367.0 35.0
TLC27L2MDRG4 SOIC D 8 2500 367.0 367.0 35.0
TLC27L7CDR SOIC D 8 2500 340.5 338.1 20.6
TLC27L7CPSR SO PS 8 2000 367.0 367.0 38.0
TLC27L7IDR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 12-Aug-2013
Pack Materials-Page 2