Datasheet
SLOS190G − FEBRUARY 1997 − REVISED MAY 2004
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLC2272 AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max
At 25°C
SMALL
OUTLINE
†
(D)
CERAMIC
LCC
(FK)
CERAMIC
DIP
(JG)
PLASTIC DIP
(P)
TSSOP
‡
(PW)
CERAMIC
FLAT PACK
(U)
0°C to 70°C
950 µV
TLC2272ACD
—
—
TLC2272ACP
TLC2272ACPW
—
0°C to 70°C
950 µV
2.5 mV
TLC2272ACD
TLC2272CD
—
—
—
—
TLC2272ACP
TLC2272CP
TLC2272CPW
—
—
950 µV
TLC2272AID
—
—
TLC2272AIP
—
—
−40°C to 125°C
950 µV
2.5 mV
TLC2272AID
TLC2272ID
—
—
—
—
TLC2272AIP
TLC2272IP
TLC2272IPW
—
—
−40
°
C to 125
°
C
950 µV
TLC2272AQD
—
—
—
TLC2272AQPW
—
950 µV
2.5 mV
TLC2272AQD
TLC2272QD
—
—
—
—
—
TLC2272AQPW
TLC2272QPW
—
—
−55°C to 125°C
950 µV
TLC2272AMD
TLC2272AMFK
TLC2272AMJG
TLC2272AMP
—
TLC2272AMU
−55
°
C to 125
°
C
950 µV
2.5 mV
TLC2272AMD
TLC2272MD
TLC2272AMFK
TLC2272MFK
TLC2272AMJG
TLC2272MJG
TLC2272AMP
TLC2272MP
—
TLC2272AMU
TLC2272MU
†
The D packages are available taped and reeled. Add R suffix to the device type (e.g., TLC2272CDR).
‡
The PW package is available taped and reeled. Add R suffix to the device type (e.g., TLC2272PWR).
§
Chips are tested at 25°C.
TLC2274 AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
†
(D)
CERAMIC
LCC
(FK)
CERAMIC
DIP
(J)
PLASTIC
DIP
(N)
TSSOP
‡
(PW)
CERAMIC
FLAT PACK
(W)
0°C to 70°C
950 µV
TLC2274ACD
—
—
TLC2274ACN
TLC2274ACPW
—
0°C to 70°C
950 µV
2.5 mV
TLC2274ACD
TLC2274CD
— —
TLC2274ACN
TLC2274CN
TLC2274ACPW
TLC2274CPW
—
950 µV
TLC2274AID
—
—
TLC2274AIN
TLC2274AIPW
—
−40°C to 125°C
950 µV
2.5 mV
TLC2274AID
TLC2274ID
— —
TLC2274AIN
TLC2274IN
TLC2274AIPW
TLC2274IPW
—
−40°C to 125°C
950 µV
TLC2274AQD
—
—
—
—
—
950 µV
2.5 mV
TLC2274AQD
TLC2274QD
— — — — —
−55°C to 125°C
950 µV
TLC2274AMD
TLC2274AMFK
TLC2274AMJ
TLC2274AMN
—
TLC2274AMW
−55
°
C to 125
°
C
950 µV
2.5 mV
TLC2274AMD
TLC2274MD
TLC2274AMFK
TLC2274MFK
TLC2274AMJ
TLC2274MJ
TLC2274AMN
TLC2274MN
—
TLC2274AMW
TLC2274MW
†
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2274CDR).
‡
The PW package is available taped and reeled.
§
Chips are tested at 25°C.