Datasheet

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLC071CDGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0
TLC071CDR SOIC D 8 2500 340.5 338.1 20.6
TLC071IDGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0
TLC071IDR SOIC D 8 2500 340.5 338.1 20.6
TLC072AIDR SOIC D 8 2500 340.5 338.1 20.6
TLC072CDGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0
TLC072CDR SOIC D 8 2500 340.5 338.1 20.6
TLC072IDGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0
TLC072IDR SOIC D 8 2500 340.5 338.1 20.6
TLC073AIDR SOIC D 14 2500 367.0 367.0 38.0
TLC073CDR SOIC D 14 2500 367.0 367.0 38.0
TLC073IDGQR MSOP-PowerPAD DGQ 10 2500 358.0 335.0 35.0
TLC074AIDR SOIC D 14 2500 367.0 367.0 38.0
TLC074CDR SOIC D 14 2500 367.0 367.0 38.0
TLC074CDR SOIC D 14 2500 333.2 345.9 28.6
TLC074CPWPR HTSSOP PWP 20 2000 367.0 367.0 38.0
TLC074IDR SOIC D 14 2500 367.0 367.0 38.0
TLC075AIDR SOIC D 16 2500 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 12-Aug-2013
Pack Materials-Page 3