Datasheet

TL1963A-xx
www.ti.com SLVS719F –JUNE 2008– REVISED MAY 2011
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
IN –20 V to 20 V
OUT –20 V to 20 V
Input-to-output differential
(2)
–20 V to 20 V
V
IN
Input voltage range
SENSE –20 V to 20 V
ADJ –7 V to 7 V
SHDN –20 V to 20 V
t
short
Output short-circuit duration Indefinite
T
lead
Maximum lead temperature 10-second soldering time 300°C
T
J
Operating virtual-junction temperature range –40°C to 125°C
T
stg
Storage temperature range –65°C to 150°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Absolute maximum input-to-output differential voltage cannot be achieved with all combinations of rated IN pin and OUT pin voltages.
With the IN pin at 20 V, the OUT pin may not be pulled below 0 V. The total measured voltage from IN to OUT cannot exceed ±20 V.
PACKAGE THERMAL DATA
(1)
PACKAGE BOARD θ
JA
θ
JC
θ
JP
(2)
SOT-223 (DCY) High K, JESD 51-5 48.3°C/W 30.6°C/W —
SOT-223 (DCQ) High K, JESD 51-5 53°C/W 15°C/W —
TO-263 (KTT) High K, JESD 51-5 26.5°C/W 24.1°C/W 0.38°C/W
(1) Maximum power dissipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambient
temperature is P
D
= (T
J
(max) – T
A
)/θ
JA
. Operating at the absolute maximum T
J
of 150°C can affect reliability.
(2) For packages with exposed thermal pads, such as QFN, PowerPAD™, and PowerFLEX™, θ
JP
is defined as the thermal resistance
between the die junction and the bottom of the exposed pad.
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