Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
81023012A OBSOLETE LCCC FK 20 TBD Call TI Call TI -55 to 125
81023022A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 81023022A
TL062MFKB
8102302HA ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type -55 to 125 8102302HA
TL062M
8102302PA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 8102302PA
TL062M
81023032A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 81023032A
TL064MFKB
8102303CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 8102303CA
TL064MJB
8102303DA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 8102303DA
TL064MWB
TL061ACD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 061AC
TL061ACDE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 061AC
TL061ACDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 061AC
TL061ACDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 061AC
TL061ACDRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 061AC
TL061ACDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 061AC
TL061ACP ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type 0 to 70 TL061ACP
TL061ACPE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type 0 to 70 TL061ACP
TL061BCD OBSOLETE SOIC D 8 TBD Call TI Call TI 0 to 70
TL061BCP ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type 0 to 70 TL061BCP
TL061BCPE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type 0 to 70 TL061BCP