Datasheet

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FEATURES APPLICATIONS

DESCRIPTION

THS4303

49.9 Ω

22 µF 47 pF 0.1 µF

S+

50 Ω Source

+ 22 µF 47 pF 0.1 µF

S−

30.1 Ω

FB = Ferrite Bead

100 k 1 M 10 M 100 M 1 G 10 G

f − Frequency − Hz

SMALL SIGNAL FREQUENCY RESPONSE

= 100 Ω

= 100 mV

= 5 V

Small Signal Gain − dBSmall Signal Gain − dB

49.9 Ω

50 Ω Load

THS4303

SLOS421B – NOVEMBER 2003 – REVISED JANUARY 2005

WIDEBAND FIXED-GAIN AMPLIFIER

• Wideband Signal Processing

• Fixed Closed-Loop Gain Amplifier

• Wireless Transceivers

– 10 V/V (20 dB)

• IF Amplifier

• Wide Bandwidth: 1.8 GHz

• ADC Preamplifier

• High Slew Rate: 5500 V/µs

• DAC Output Buffers

• Low Total Input Referred Noise: 2.5 nV/ √ Hz

• Test, Measurement, and Instrumentation

• Low Distortion

• Medical and Industrial Imaging

– HD

: –65 dBc at 70 MHz

– HD

: –76 dBc at 70 MHz

– IMD

: –85 dBc at 100 MHz

The THS4303 device is a wideband, fixed-gain ampli-

– OIP

: 34 dBm at 100 MHz

fier that offers high bandwidth, high slew rate, low

noise, and low distortion. This combination of specifi-

– IMD

: –70 dBc at 300 MHz

cations enables analog designers to transcend cur-

– OIP

: 27 dBm at 300 MHz

rent performance limitations and process analog sig-

• High Output Drive: ± 180 mA

nals at much higher speeds than previously possible

with closed-loop, complementary amplifier designs.

• Power Supply Voltage: 3 V or 5 V

The devices are offered in a 16-pin leadless package

and incorporate a power-down mode for quiescent

power savings.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PowerPAD is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (29 pages)

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THS4303 www.ti.com SLOS421B – NOVEMBER 2003 – REVISED JANUARY 2005 WIDEBAND FIXED-GAIN AMPLIFIER FEATURES APPLICATIONS • • • • • • • • • • • • • • Fixed Closed-Loop Gain Amplifier – 10 V/V (20 dB) Wide Bandwidth: 1.8 GHz High Slew Rate: 5500 V/µs Low Total Input Referred Noise: 2.
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THS4303 www.ti.com SLOS421B – NOVEMBER 2003 – REVISED JANUARY 2005 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
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THS4303 www.ti.com SLOS421B – NOVEMBER 2003 – REVISED JANUARY 2005 RECOMMENDED OPERATING CONDITIONS (1) Dual supply Supply voltage, (VS+ and VS–) MAX ±1.5 ±2.5 3 5 VS–+1 VS+–1 Single supply Input common-mode voltage range (1) MIN UNIT V V This data was taken using 2 oz. trace and copper pad that is soldered directly to a 3 in. x 3 in. PCB. For further information, refer to Application Information section of this data sheet.
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THS4303 www.ti.com SLOS421B – NOVEMBER 2003 – REVISED JANUARY 2005 ELECTRICAL CHARACTERISTICS THS4303 (Gain = +10 V/V) Specifications: VS = 5 V, RL = 100 Ω, (unless otherwise noted) TYP PARAMETER TEST CONDITIONS OVER TEMPERATURE UNITS MIN/ MAX 1.8 GHz Typ 18 GHz Typ 25°C 25°C 0°C to 70°C –40°C to 85°C AC PERFORMANCE Small signal bandwidth G = +10, VO = 200 mVRMS Gain bandwidth product Full-power bandwidth G = +10, VO = 2 Vpp Slew rate G = +10, VO = 2 V Step 1.
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THS4303 www.ti.com SLOS421B – NOVEMBER 2003 – REVISED JANUARY 2005 ELECTRICAL CHARACTERISTICS (continued) THS4303 (Gain = +10 V/V) Specifications: VS = 5 V, RL = 100 Ω, (unless otherwise noted) TYP PARAMETER TEST CONDITIONS OVER TEMPERATURE 25°C 25°C 0°C to 70°C –40°C to 85°C UNITS MIN/ MAX mA Max POWER-DOWN CHARACTERISTICS Maximum power-down current 0.9 1.2 Power-on voltage threshold PD = 0 V 1.1 1.5 1.3 1.4 V Min Power-down voltage threshold 1.1 0.
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THS4303 www.ti.
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THS4303 www.ti.com SLOS421B – NOVEMBER 2003 – REVISED JANUARY 2005 TYPICAL TEST DATA S-Parameter (Measured using standard THS4303EVM, edge number 6454762, with VS = 5 V in a 50 Ω test system) Frequency (MHz) S11 (dB) S11 (Ang) S21 (dB) S21 (Ang) 1 –50.68359 –9.936035 20.07422 1.007886 2 –50.80664 –3.452515 20.08398 2.060587 10 –51.10547 –38.07227 20.02734 10.158346 50 –37.71289 –76.30078 20.08252 50.078859 100 –34.61719 –109.6055 20.29541 150 –31.50684 –105.7422 200 –29.
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THS4303 www.ti.com SLOS421B – NOVEMBER 2003 – REVISED JANUARY 2005 TYPICAL THS4303 CHARACTERISTICS (5 V) S-PARAMETER vs FREQUENCY SMALL SIGNAL FREQUENCY RESPONSE 22 40 VS = 5 V 20 0 S22 −20 S11 −40 −60 18 16 14 RL = 100 Ω VO = 100 mVPP VS = 5 V S12 12 −80 1M 10 M 100 M 1G 10 G 100 k 1M −55 10 M 100 M 1G 0 10 G 100 k Rise 3000 2000 0.5 1 1.
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THS4303 www.ti.com SLOS421B – NOVEMBER 2003 – REVISED JANUARY 2005 TYPICAL THS4303 CHARACTERISTICS (5 V) (continued) THIRD-ORDER OUTPUT INTERCEPT vs FREQUENCY 70 49.9 −2.5V 65 Note: Add 3 dB to Reference Data to The Output of the Amplifier. 60 55 50 VO = 1 VPP Envelope RL = 100 Ω VS = 5 V 200 kHz Tone Spacing 45 40 0 50 100 150 200 250 300 f − Frequency − MHz 41 −2.5V 35 Note: Add 3 dB to Reference Data to The Output of the Amplifier.
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THS4303 www.ti.
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THS4303 www.ti.com SLOS421B – NOVEMBER 2003 – REVISED JANUARY 2005 TYPICAL THS4303 CHARACTERISTICS (5 V) (continued) POWER-DOWN QUIESCENT CURRENT vs SUPPLY VOLTAGE 0.1 1M 10 M 100 M 1G 1000 900 10 S22 0 TA = 85°C TA = 25°C 800 TA = −40°C 700 600 500 400 300 200 f − Frequency − Hz S11 −30 −40 −50 −60 −70 S12 −90 100 k VS − Supply Voltage − V Figure 27. 10 M 1M I O − Output Current Level − mA 2 RL = 100 Ω VS = 5 V 1 0.5 Input 0 1M −0.5 −1 Output −2 −1.5 −2.
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THS4303 www.ti.
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THS4303 www.ti.com SLOS421B – NOVEMBER 2003 – REVISED JANUARY 2005 TYPICAL THS4303 CHARACTERISTICS (3 V) (continued) POWER-DOWN S-PARAMETER vs FREQUENCY OVERDRIVE RECOVERY TIME VS = 3 V 10 0.15 0 S22 0.1 1 0.5 0.05 0 0 −0.5 −0.05 −1 −0.1 −1.5 −0.15 −2 0 −0.2 100 200 300 400 500 600 700 800 900 1000 t − Time − ns Figure 41. VI − Input Voltage − V VO − Output Voltage − V 1.5 0.
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THS4303 www.ti.com SLOS421B – NOVEMBER 2003 – REVISED JANUARY 2005 APPLICATION INFORMATION HIGH-SPEED OPERATIONAL AMPLIFIERS The THS4303 fixed gain operational amplifier set new performance levels, combining low distortion, high slew rates, low noise, and a gain bandwidth in excess of 1.8 GHz. To achieve the full performance of the amplifier, careful attention must be paid to printed-circuit board layout and component selection. equipment, provides a 100-Ω load.
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THS4303 www.ti.com SLOS421B – NOVEMBER 2003 – REVISED JANUARY 2005 SINGLE SUPPLY OPERATION The THS4303 is designed to operate from a single 3-V to 5-V power supply. When operating from a single power supply, care must be taken to ensure the input signal and amplifier are biased appropriately to allow for the maximum output voltage swing. The circuits shown in Figure 44 demonstrate methods to configure an amplifier in a manner conducive for single supply operation. VS+ + FB 22 µF 47 pF 0.1 µF Rg *2.
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THS4303 www.ti.com SLOS421B – NOVEMBER 2003 – REVISED JANUARY 2005 The second circuit depicts single-ended ADC drive. While not recommended for optimum performance using converters with differential inputs, satisfactory performance can sometimes be achieved with singleended input drive. An example circuit is shown here for reference. VS+ + FB 22 µF 0.1 µF 47 pF 30.1 Ω Rf Rg 50 Ω Source _ + *2.
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THS4303 www.ti.com SLOS421B – NOVEMBER 2003 – REVISED JANUARY 2005 to the caps, and 3 or more vias to connect the caps to the ground plane. 2. Placement priority should put the smallest valued capacitors closest to the device. 3. Solid power planes can lead to PCB resonances when they are not properly terminated to the ground plane over the area and along the perimeter of the power plane by high frequency capacitors. Doing so assures that there are no power plane resonances in the needed frequency range.
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THS4303 SLOS421B – NOVEMBER 2003 – REVISED JANUARY 2005 and may be shared among several devices in the same area of the PC board. A very low inductance path should be used to connect the inverting pin of the amplifier to ground. A minimum of 5 vias as close to the part as possible is recommended. 3. Careful selection and placement of external components preserves the high frequency performance of the THS4303. Resistors should be a very low reactance type.
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THS4303 www.ti.com SLOS421B – NOVEMBER 2003 – REVISED JANUARY 2005 During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be soldered to a copper area underneath the package. Through the use of thermal paths within this copper area, heat can be conducted away from the package into either a ground plane or other heat dissipating device.
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THS4303 www.ti.com SLOS421B – NOVEMBER 2003 – REVISED JANUARY 2005 THERMAL ANALYSIS The THS4303 device does not incorporate automatic thermal shutoff protection, so the designer must take care to ensure that the design does not violate the absolute maximum junction temperature of the device. Failure may result if the absolute maximum junction temperature of 150° C is exceeded. The thermal characteristics of the device are dictated by the package and the PC board.
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THS4303 www.ti.com SLOS421B – NOVEMBER 2003 – REVISED JANUARY 2005 VS+ FB2 J3 C2 22 µF + 13 NC 14 47 pF C4 0.1 µF R5 30.1 Ω 9 _ + PD J6 A Rf Rg J1 R4 49.9 Ω C9 * 6454762 12 11 10 VI C6 U1 8 7 6 5 R2 49.9 Ω 16 J2 VO R3 * C1 1 2 1 µF VS− 3 C7 * J4 C3 22 µF 4 + C8 47 pF FB1 C5 0.1 µF R4 30.1 Ω * = Not populated Figure 51. Typical THS4303 EVM Circuit Configuration Figure 52. THS4303EVM Layout (Top Layer and Silkscreen Layer) Figure 53.
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THS4303 www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device THS4303RGTT Package Package Pins Type Drawing QFN RGT 16 SPQ 250 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 180.0 12.4 Pack Materials-Page 1 3.3 B0 (mm) K0 (mm) P1 (mm) 3.3 1.1 8.0 W Pin1 (mm) Quadrant 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) THS4303RGTT QFN RGT 16 250 210.0 185.0 35.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.