Datasheet

DIE

Side View (a)

End View (b) Bottom View (c)

DIE

Thermal

Pad

THS4130

THS4131

SLOS318H –MAY 2000–REVISED MAY 2011

www.ti.com

GENERAL PowerPAD DESIGN CONSIDERATIONS

The THS413x is available packaged in a thermally-enhanced DGN package, which is a member of the

PowerPAD family of packages. This package is constructed using a downset leadframe upon which the die is

mounted (see Figure 43a and Figure 43b). This arrangement results in the lead frame being exposed as a

thermal pad on the underside of the package (see Figure 43c). Because this thermal pad has direct thermal

contact with the die, excellent thermal performance can be achieved by providing a good thermal path away from

the thermal pad.

The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.

During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be

soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,

heat can be conducted away from the package into either a ground plane or other heat dissipating device.

The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of the

surface mount with the previously awkward mechanical methods of heatsinking.

More complete details of the PowerPAD installation process and thermal management techniques can be found

in the Texas Instruments Technical Brief, (PowerPAD Thermally-Enhanced Package SLMA002). This document

can be found at the TI web site (www.ti.com) by searching on the key word PowerPAD. The document can also

be ordered through your local TI sales office. Refer to literature number SLMA002 when ordering.

A. The thermal pad (PowerPAD) is electrically isolated from all other pins and can be connected to any potential from

CC–

to V

CC+

. Typically, the thermal pad is connected to the ground plane becase this plane tends to physically be the

largest and is able to dissipate the most amount of heat.

Figure 43. Views of Thermally-Enhanced DGN Package