Datasheet

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

(4)

Samples

SN65LVDS386DGG ACTIVE TSSOP DGG 64 25 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 LVDS386

SN65LVDS386DGGG4 ACTIVE TSSOP DGG 64 25 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 LVDS386

SN65LVDS386DGGR ACTIVE TSSOP DGG 64 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 LVDS386

SN65LVDS386DGGRG4 ACTIVE TSSOP DGG 64 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 LVDS386

SN65LVDS388ADBT ACTIVE TSSOP DBT 38 50 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 LVDS388A

SN65LVDS388ADBTG4 ACTIVE TSSOP DBT 38 50 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 LVDS388A

SN65LVDS388ADBTR ACTIVE TSSOP DBT 38 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 LVDS388A

SN65LVDS388ADBTRG4 ACTIVE TSSOP DBT 38 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 LVDS388A

SN65LVDS390D ACTIVE SOIC D 16 40 Green (RoHS

& no Sb/Br)