Datasheet

1
FEATURES
Seemechanicaldrawingsfordimensions.
DBVPACKAGE
(TOP VIEW)
DCKPACKAGE
(TOP VIEW)
2
GND
V
CC
5
3
4
2A
2Y
6
1
1A
1Y
3
4
2A
2
GND
2Y
5
1
1A
V
CC
6
1Y
DESCRIPTION/ORDERING INFORMATION
SN74LVC2G17-Q1
www.ti.com .................................................................................................................................................... SCES618B – OCTOBER 2004 – REVISED APRIL 2008
DUAL SCHMITT-TRIGGER BUFFER
• Qualified for Automotive Applications
• Supports 5-V V
CC
Operation
• Inputs Accept Voltages to 5.5 V
• Max t
pd
of 5.4 ns at 3.3 V
• Low Power Consumption, 10- µ A Max I
CC
• ± 24-mA Output Drive at 3.3 V
• Typical V
OLP
(Output Ground Bounce)
<0.8 V at V
CC
= 3.3 V, T
A
= 25 ° C
• Typical V
OHV
(Output V
OH
Undershoot)
>2 V at V
CC
= 3.3 V, T
A
= 25 ° C
• I
off
Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 1000-V Charged-Device Model (C101)
This dual Schmitt-trigger buffer is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC2G17 contains two buffers and performs the Boolean function Y = A. The device functions as two
independent buffers, but because of Schmitt action, it may have different input threshold levels for positive-going
(V
T+
) and negative-going (V
T –
) signals.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
SOT (SOT-23) – DBV Reel of 3000 SN74LVC2G17QDBVRQ1 C17_
– 40 ° C to 125 ° C
SOT (SC-70) – DCK Reel of 3000 SN74LVC2G17QDCKRQ1 C7_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(3) DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site. Pin 1 identifier
indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
(EACH INVERTER)
INPUT OUTPUT
A Y
H H
L L
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2004 – 2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.