Datasheet

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

5962-8550701VRA ACTIVE CDIP J 20 20 TBD A42 N / A for Pkg Type -55 to 125 5962-8550701VR

SNV54HCT374J

5962-8550701VSA ACTIVE CFP W 20 25 TBD Call TI N / A for Pkg Type -55 to 125 5962-8550701VS

SNV54HCT374W

85507012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 85507012A

SNJ54HCT

374FK

8550701RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8550701RA

SNJ54HCT374J

JM38510/65652BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

65652BRA

M38510/65652BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

65652BRA

SN54HCT374J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HCT374J

SN74HCT374DBR ACTIVE SSOP DB 20 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 HT374

SN74HCT374DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 HT374

SN74HCT374DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 HT374

SN74HCT374DW ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br)