Datasheet

5
SN54HC32 , SN74HC32
www.ti.com SCLS200E –DECEMBER 1982–REVISED JULY 2016
Product Folder Links: SN54HC32 SN74HC32
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(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information: SN54HC32
THERMAL METRIC
(1)
SN54HC32
UNITCDIP (J) CFP (W) LCCC (FK)
14 PINS 14 PINS 20 PINS
R
θJA
Junction-to-ambient thermal resistance — — — °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 54.9 88.3 61 °C/W
R
θJB
Junction-to-board thermal resistance 80.1 156 59.6 °C/W
ψ
JT
Junction-to-top characterization parameter — — — °C/W
ψ
JB
Junction-to-board characterization parameter — — — °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance 25.1 15.2 11.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Thermal Information: SN74HC32
THERMAL METRIC
(1)
SN74HC32
UNITSOIC (D) SSOP (DB) PDIP (N) SOP (NS) TSSOP (PW)
14 PINS 14 PINS 14 PINS 14 PINS 14 PINS
R
θJA
Junction-to-ambient
thermal resistance
90.1 105.4 54.9 88.8 119.6 °C/W
R
θJC(top)
Junction-to-case (top)
thermal resistance
50.3 57.3 42.5 46.5 48.4 °C/W
R
θJB
Junction-to-board
thermal resistance
44.4 52.7 34.7 47.6 61.3 °C/W
ψ
JT
Junction-to-top
characterization parameter
17.9 22.6 27.9 16.8 5.6 °C/W
ψ
JB
Junction-to-board
characterization parameter
44.1 52.2 34.6 47.2 60.7 °C/W
R
θJC(bot)
Junction-to-case (bottom)
thermal resistance
— — — — — °C/W
6.6 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
OH
V
I
= V
IH
or V
IL
I
OH
= –20 µA
V
CC
= 2 V 1.9 1.998
V
V
CC
= 4.5 V 4.4 4.499
V
CC
= 6 V 5.9 5.999
I
OH
= –4 mA, V
CC
= 4.5 V
T
A
= 25°C 3.98 4.3
SN54HC32 3.7
SN74HC32 3.84
I
OH
= –5.2 mA, V
CC
= 6 V
T
A
= 25°C 5.48 5.8
SN54HC32 5.2
SN74HC32 5.34