Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN65LVDS387DGGR TSSOP DGG 64 2000 346.0 346.0 41.0
SN65LVDS389DBTR TSSOP DBT 38 2000 346.0 346.0 33.0
SN65LVDS391DR SOIC D 16 2500 346.0 346.0 33.0
SN65LVDS391PWR TSSOP PW 16 2000 346.0 346.0 29.0
SN75LVDS387DGGR TSSOP DGG 64 2000 346.0 346.0 41.0
SN75LVDS389DBTR TSSOP DBT 38 2000 346.0 346.0 33.0
SN75LVDS391DR SOIC D 16 2500 346.0 346.0 33.0
SN75LVDS391PWR TSSOP PW 16 2000 346.0 346.0 29.0
PACKAGE MATERIALS INFORMATION
www.ti.com 25-Sep-2009
Pack Materials-Page 2