Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsInterface ICsInterface IC - transceivers RS485 1/1 SOIC 8

  

      



SLLS173F − JANUARY 1994 − REVISED APRIL 2006

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

D Designed for High-Speed Multipoint Data

Transmission Over Long Cables

D Operates With Pulse Widths as Low

as 30 ns

D Low Supply Current ...5 mA Max

D Meets or Exceeds the Standard

Requirements of ANSI RS-485 and

ISO 8482:1987(E)

D Common-Mode Voltage Range of −7 V

to 12 V

D Positive- and Negative-Output Current

Limiting

D Driver Thermal Shutdown Protection

D Pin Compatible With the SN75179B

description

The SN65LBC179, SN65LBC179Q, and

SN75LBC179 differential driver and receiver pairs

are monolithic integrated circuits designed for

bidirectional data communication over long

cables that take on the characteristics of

transmission lines. They are balanced, or

differential, voltage mode devices that meet or

exceed the requirements of industry standards

ANSI RS-485 and ISO 8482:1987(E). Both

devices are designed using TI’s proprietary

LinBiCMOS with the low power consumption of

CMOS and the precision and robustness of

bipolar transistors in the same circuit.

The SN65LBC179, SN65LBC179Q, and

SN75LBC179 combine a differential line driver

and differential line receiver and operate from a

single 5-V supply. The driver differential outputs

and the receiver differential inputs are connected

to separate terminals for full-duplex operation and

are designed to present minimum loading to the

bus when powered off (V

= 0). These parts

feature a wide common-mode voltage range

making them suitable for point-to-point or

multipoint data bus applications. The devices also

provide positive- and negative-current limiting

and thermal shutdown for protection from line fault

conditions. The line driver shuts down at a junction

temperature of approximately 172°C.

  !"# $ %&'# "$  (&)*%"# +"#',

+&%#$ %! # $('%%"#$ (' #-' #'!$  '."$ $#&!'#$

$#"+"+ /""#0, +&%# (%'$$1 +'$ # '%'$$"*0 %*&+'

#'$#1  "** (""!'#'$,

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

LinBiCMOS is a trademark of Texas Instruments.

ogic symbol

†

ogic diagram (positive logic)

†

This symbol is in accordance with ANSI/IEEE Std 91-1984

and IEC Publication 617-12.

INPUT

OUTPUTS

Y Z

DRIVER

DIFFERENTIAL INPUTS

A−B

≥ 0.2 V

−0.2 V < V

< 0.2 V

≤ − 0.2 V

Open circuit

OUTPUT

RECEIVER

high

level, L

low

level,

indeterminate

Function Tables

GND

D OR P PACKAGE

(TOP VIEW)

Summary of content (19 pages)

PAGE 1
SLLS173F − JANUARY 1994 − REVISED APRIL 2006 D Designed for High-Speed Multipoint Data D D D D D D D D OR P PACKAGE (TOP VIEW) Transmission Over Long Cables Operates With Pulse Widths as Low as 30 ns Low Supply Current . . .
PAGE 2
SLLS173F − JANUARY 1994 − REVISED APRIL 2006 description (continued) The SN65LBC179, SN65LBC179Q, and SN75LBC179 are available in the 8-pin dual-in-line and small-outline packages. The SN75LBC179 is characterized for operation over the commercial temperature range of 0°C to 70°C. The SN65LBC179 is characterized over the industrial temperature range of − 40°C to 85°C.
PAGE 3
SLLS173F − JANUARY 1994 − REVISED APRIL 2006 absolute maximum ratings† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V Voltage range at A, B, Y, or Z (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −10 V to 15 V Voltage range at D or R (see Note 1) . . . . . .
PAGE 4
SLLS173F − JANUARY 1994 − REVISED APRIL 2006 DRIVER SECTION electrical characteristics over recommended operating conditions (unless otherwise noted) PARAMETER VIK TEST CONDITIONS Input clamp voltage TYP† II = − 18 mA RL = 54 Ω, See Figure 1 | VOD | MIN Differential output voltage (see Note 3) RL = 60 Ω, See Figure 2 UNIT −1.5 V SN65LBC179, SN65LBC179Q 1.1 2.2 5 SN75LBC179 1.5 2.
PAGE 5
SLLS173F − JANUARY 1994 − REVISED APRIL 2006 RECEIVER SECTION electrical characteristics over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS VIT + VIT − Positive-going input threshold voltage Vhys VOH Hysteresis voltage ( VIT + − VIT −) VOL Low-level output voltage II MIN IO = − 8 mA IO = 8 mA Negative-going input threshold voltage High-level output voltage MAX 0.2 −0.
PAGE 6
SLLS173F − JANUARY 1994 − REVISED APRIL 2006 PARAMETER MEASUREMENT INFORMATION Vtest R1 375 Ω Y D RL = 60 Ω 0 V or 3 V VOD Z R2 375 Ω −7 V < Vtest < 12 V Vtest Figure 2. Differential Output Voltage Test Circuit 3V Input Generator (see Note A) RL = 54 Ω 50 Ω 1.5 V 1.5 V 0V td(ODL) ≈ 2.5 V 50% ≈ − 2.
PAGE 7
SLLS173F − JANUARY 1994 − REVISED APRIL 2006 TYPICAL CHARACTERISTICS DRIVER DRIVER HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT 5 VCC = 5 V TA = 25°C 4.5 VCC = 5 V TA = 25°C 4.5 VOL− Low-Level Output Voltage − V VOH − High-Level Output Voltage − V 5 4 3.5 3 2.5 2 1.5 1 0.5 4 3.5 3 2.5 2 1.5 1 0.
PAGE 8
SLLS173F − JANUARY 1994 − REVISED APRIL 2006 TYPICAL CHARACTERISTICS DRIVER RECEIVER DIFFERENTIAL DELAY TIME vs FREE-AIR TEMPERATURE HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT 6 20 VID = 200 mV td(ODL) VOH − High-Level Output Voltage − V t d(OD) − Differential Delay Times − ns VCC = 5 V Load = 54 Ω 15 td(ODH) 10 5 0 − 50 5 4 3 2 1 0 − 25 100 50 75 0 25 TA − Free-Air Temperature − °C 125
PAGE 9
SLLS173F − JANUARY 1994 − REVISED APRIL 2006 TYPICAL CHARACTERISTICS RECEIVER INPUT CURRENT vs INPUT VOLTAGE (COMPLEMENTARY INPUT AT 0 V) AVERAGE SUPPLY CURRENT vs FREQUENCY 60 1 Receiver Load = 50 pF Driver Load = Receiver Inputs 0.8 50 0.6 45 0.4 I I − Input Current − mA 40 35 30 25 20 15 10 0 10 K 0.2 0 − 0.2 − 0.4 − 0.6 − 0.
PAGE 10
SLLS173F − JANUARY 1994 − REVISED APRIL 2006 THERMAL CHARACTERISTICS − D PACKAGE TEST CONDITIONS PARAMETER Junction−to−ambient thermal reisistance, θJA† Junction−to−board thermal reisistance, θJB TYP 199.4 High-K board, no air flow 119 High-K board, no air flow 67 Junction−to−case thermal reisistance, θJC Average power dissipation, P(AVG) MIN Low-K board, no air flow MAX UNIT °C/W 46.
PAGE 11
SLLS173F − JANUARY 1994 − REVISED APRIL 2006 THERMAL CHARACTERISTICS OF IC PACKAGES ΘJA (Junction-to-Ambient Thermal Resistance) is defined as the difference in junction temperature to ambient temperature divided by the operating power ΘJA is NOT a constant and is a strong function of D D D the PCB design (50% variation) altitude (20% variation) device power (5% variation) ΘJA can be used to compare the thermal per
PAGE 12
PACKAGE OPTION ADDENDUM www.ti.
PAGE 13
PACKAGE OPTION ADDENDUM www.ti.com 26-Mar-2010 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information.
PAGE 14
PACKAGE MATERIALS INFORMATION www.ti.com 23-Mar-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN65LBC179DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 SN75LBC179DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.
PAGE 15
PACKAGE MATERIALS INFORMATION www.ti.com 23-Mar-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN65LBC179DR SOIC D 8 2500 340.5 338.1 20.6 SN75LBC179DR SOIC D 8 2500 340.5 338.1 20.
PAGE 16
PAGE 17
PAGE 18
PAGE 19
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.