Datasheet
Table Of Contents
PECL DC CHARACTERISTICS
TTL DC CHARACTERISTICS
AC CHARACTERISTICS
SN65ELT22
www.ti.com
............................................................................................................................................................................................ SLLS924 – DECEMBER 2008
At V
CC
= 5.0 V, GND = 0.0 V (unless otherwise noted)
(1) (2)
T
A
= – 40 ° C T
A
= 25 ° C T
A
= 85 ° C
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX
I
CC
Power supply current 17.3 20 18.2 20 19.4 22 mA
V
OH
High-level output voltage See
(3)
3915 3954 4120 3915 3958 4120 3915 3961 4120 mV
V
OL
Low-level output voltage See
(3)
3170 3236 3380 3170 3231 3380 3170 3229 3380 mV
(1) The device meets the specifications after thermal balance has been established when mounted in a socket or printed circuit board with
maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature
range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied
individually under normal operating conditions and not valid simultaneously.
(2) Input and output parameters vary 1:1 with V
CC
. V
CC
can vary +0.7 V / – 0.8 V.
(3) Outputs are terminated through a 50- Ω resistor to V
CC
– 2.0 V.
At V
CC
= 4.2 V to 5.7 V, T
A
= – 40 ° C to 85 ° C (unless otherwise noted)
(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
I
IH
High-level input current V
IN
= 2.7 V, V
IN
= (V
CC
– 0.025) V 20 µ A
I
IHH
High-level input current V
IN
= V
CC
20 µ A
I
IL
Low-level input current V
IN
= 0.5 V, V
IN
= (GND + 0.025) V – 200 µ A
V
IK
Input clamp diode voltage I
IN
= – 18 mA – 1.2 V
V
IH
High-level input voltage 2.0 Vcc – 0.025 V
V
IL
Low-level input voltage GND + 0.025 0.8 V
(1) The device meets the specifications after thermal balance has been established when mounted in a socket or printed circuit board with
maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature
range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied
individually under normal operating conditions and not valid simultaneously
At V
CC
= 4.2 V to 5.7 V, GND = 0.0 V (unless otherwise noted)
(1)
T
A
= – 40 ° C T
A
= 25 ° C T
A
= 85 ° C
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX
Max switching
f
MAX
frequency
(2)
, 500 490 470 MHz
see Figure 5
t
PLH
0.6 0.83 1.1 0.6 0.84 1.1 0.6 0.85 1.1
Propagation delay time 1.5 V to 50% ns
t
PHL
0.5 0.9 0.5 0.9 0.5 0.9
Within device skew See
(3)
25 90 25 90 25 90
t
SKEW
ps
Device-to-device skew See
(4)
25 100 25 100 25 100
Random clock jitter
t
JITTER
0.5 0.5 0.5 ps
(RMS)
t
r
/t
f
Output rise/fall times Q (20% – 80%) 0.7 1.1 0.7 1.1 0.7 1.1 ns
(1) The device meets the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating
temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are
applied individually under normal operating conditions and not valid simultaneously.
(2) Maximum switching frequency measured at output amplitude of 300 mV
pp
.
(3) Measured between outputs under the identical transitions and conditions on any one device.
(4) Device-to-device skew for identical transitions at identical V
CC
levels.
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