Datasheet

3
®
OPA627, 637
PIN CONFIGURATIONS
DIP/SOIC
Top View
Offset Trim
–In
+In
–V
No Internal Connection
+V
Output
Offset Trim
S
S
1
2
3
4
8
7
6
5
Top View
TO-99
Offset Trim
–In
Output
Offset Trim
+In
–V
S
+V
S
No Internal Connection
Case connected to –V
S
.
8
1
2
3
4
5
6
7
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage .................................................................................. ±18V
Input Voltage Range .............................................. +V
S
+ 2V to –V
S
– 2V
Differential Input Range....................................................... Total V
S
+ 4V
Power Dissipation ........................................................................ 1000mW
Operating Temperature
M Package .................................................................. –55°C to +125°C
P, U Package ............................................................. –40°C to +125°C
Storage Temperature
M Package .................................................................. –65°C to +150°C
P, U Package ............................................................. –40°C to +125°C
Junction Temperature
M Package .................................................................................. +175°C
P, U Package ............................................................................. +150°C
Lead Temperature (soldering, 10s) ............................................... +300°C
SOlC (soldering, 3s) ................................................................... +260°C
NOTE: (1) Stresses above these ratings may cause permanent damage.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PACKAGE/ORDERING INFORMATION
PACKAGE DRAWING TEMPERATURE
PRODUCT PACKAGE NUMBER
(1)
RANGE
OPA627AP Plastic DIP 006 –25°C to +85°C
OPA627BP Plastic DIP 006 –25°C to +85°C
OPA627AU SOIC 182 –25°C to +85°C
OPA627AM TO-99 Metal 001 –25°C to +85°C
OPA627BM TO-99 Metal 001 –25°C to +85°C
OPA627SM TO-99 Metal 001 –55°C to +125°C
OPA637AP Plastic DIP 006 –25°C to +85°C
OPA637BP Plastic DIP 006 –25°C to +85°C
OPA637AU SOIC 182 –25°C to +85°C
OPA637AM TO-99 Metal 001 –25°C to +85°C
OPA637BM TO-99 Metal 001 –25°C to +85°C
OPA637SM TO-99 Metal 001 –55°C to +125°C
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.