Datasheet

""#
SBOS156B − MARCH 1987 − REVISED APRIL 2008
www.ti.com
7
TYPICAL CHARACTERISTICS (continued)
At T
A
= +25°C and V
S
= ±40V, unless otherwise noted.
−
50
−
25 0 25 75 100 125
Temperature (
_
C)
0
Dissipation (W)
MAXIMUM POWER DISSIPATION
vs TEMPERATURE
50
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Plastic DIP
No Heat Sink
T
J
(max)
TO−99: 150
_
C
DIP, SO: 125
_
C
TO−99
SO−8
Surface−Mount
(non PowerPAD)
−
50
−
25 0 25 75 100 125
Temperature (
_
C)
Dissipation (W)
MAXIMUM POWER DISSIPATION
vs TEMPERATURE
50
2.0
1.5
1.0
0.5
0
T
J
(125
_
Cmax)=T
A
+[(|V
S
|
−
|V
O
|) I
O
×θ
JA
]
θ
JA
=52
_
C/W, SO−8 PowerPAD
(1in
×
0.5in heat−spreader, 1oz Copper)
T
J
=25
_
C + (1.93W
×
52
_
C/W) = +125
_
C
SO−8 PowerPAD:
T
J(max)
= +125
_
C
MAXIMUM OUTPUT VOLTAGE SWING
vs FREQUENCY
100k
Frequency (Hz)
1k 10k 1M
90
80
70
60
50
40
30
20
10
Output Voltage (V
PP
)
0
Maximum output
without slew−rate
induced distortion.
10pF 100pF 1nF 10nF
Load Capacitance
Overshoot (%)
SMALL−SIGNAL OVERSHOOT
vs LOAD CAPACITANCE
60
50
40
30
20
10
0
G=
−
1
G=+1
G=
−
2
G=10
SMALL−SIGNAL STEP RESPONSE
G=1,C
L
= 100pF
50mV/div
500ns/div
LARGE−SIGNAL STEP RESPONSE
G=1,C
L
= 100pF
10V/div
2.5
µ
s/div