Datasheet

OPA376
OPA2376
OPA4376
www.ti.com SBOS406F –JUNE 2007–REVISED MARCH 2013
ELECTRICAL CHARACTERISTICS: V
S
= +2.2V to +5.5V
Boldface limits apply over the specified temperature range: T
A
= –40°C to +125°C.
At T
A
= +25°C, R
L
= 10kΩ connected to V
S
/2, V
CM
= V
S
/2, and V
O UT
= V
S
/2, unless otherwise noted.
OPA376, OPA2376, OPA4376
PARAMETERS CONDITIONS MIN TYP MAX UNIT
OFFSET VOLTAGE
Input Offset Voltage V
OS
5 25 μV
vs Temperature dV
OS
/dT –40°C to +85°C 0.26 1 μV/°C
–40°C to +125°C 0.32 2 μV/°C
vs Power Supply PSRR V
S
= +2.2V to +5.5V, V
CM
< (V+) – 1.3V 5 20 μV/V
Over Temperature V
S
= +2.2V to +5.5V, V
CM
< (V+) – 1.3V 5 μV/V
Channel Separation, dc (dual, quad) 0.5 mV/V
INPUT BIAS CURRENT
Input Bias Current I
B
0.2 10 pA
Over Temperature See Typical Characteristics pA
Input Offset Current I
OS
0.2 10 pA
NOISE
Input Voltage Noise, f = 0.1Hz to 10Hz 0.8 μV
PP
Input Voltage Noise Density, f = 1kHz e
n
7.5 nV/√Hz
Input Current Noise, f = 1kHz i
n
2 fA/√Hz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range V
CM
(V–) – 0.1 (V+) + 0.1 V
Common-Mode Rejection Ratio CMRR (V–) < V
CM
< (V+) – 1.3 V 76 90 dB
INPUT CAPACITANCE
Differential 6.5 pF
Common-Mode 13 pF
OPEN-LOOP GAIN
Open-Loop Voltage Gain A
OL
50mV < V
O
< (V+) – 50mV, R
L
= 10kΩ 120 134 dB
100mV < V
O
< (V+) – 100mV, R
L
= 2kΩ 120 126 dB
FREQUENCY RESPONSE C
L
= 100pF, V
S
= 5.5V
Gain-Bandwidth Product GBW 5.5 MHz
Slew Rate SR G = +1 2 V/μs
Settling Time 0.1% t
S
2V Step , G = +1 1.6 μs
Settling Time 0.01% t
S
2V Step , G = +1 2 μs
Overload Recovery Time V
IN
× Gain > V
S
0.33 μs
THD + Noise THD+N V
O
= 1V
RMS
, G = +1, f = 1kHz, R
L
= 10kΩ 0.00027 %
OUTPUT
Voltage Output Swing from Rail R
L
= 10kΩ
(1)
10 20 mV
R
L
= 10kΩ
(2)
20 30 mV
Over Temperature R
L
= 10kΩ 40 mV
Voltage Output Swing from Rail R
L
= 2kΩ
(1)
40 50 mV
R
L
= 2kΩ
(2)
50 60 mV
Over Temperature R
L
= 2kΩ 80 mV
Short-Circuit Current I
SC
+30/–50 mA
Capacitive Load Drive C
LOAD
See Typical Characteristics
Open-Loop Output Impedance R
O
150 Ω
(1) SC70-5, SOT23-5, SO-8, MSOP-8, and TSSOP-14 packages only.
(2) Wafer chip-scale package only.
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