Datasheet

OPA348
OPA2348
OPA4348
SBOS213G NOVEMBER 2001REVISED MARCH 2013
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this
document, or visit the device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
VALUE UNIT
Supply Voltage, V– to V+ 7.5 V
Signal Input Terminals, Voltage
(2)
(V–) – 0.5 to (V+) + 0.5 V
Signal Input Terminals, Current
(2)
10 mA
Output Short-Circuit
(3)
Continuous
Operating Temperature –65 to +150 °C
Storage Temperature –65 to +150 °C
Junction Temperature 150 °C
Lead Temperature (soldering, 10s) 300 °C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only. Functional operation of the device at these conditions, or beyond the specified
operating conditions, is not implied.
(2) Input terminals are not diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails
should be current-limited to 10mA or less.
(3) Short-circuit to ground, one amplifier per package.
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