Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
OPA2376AIDR SOIC D 8 2500 367.0 367.0 35.0
OPA2376AIYZDR DSBGA YZD 8 3000 182.0 182.0 17.0
OPA2376AIYZDR DSBGA YZD 8 3000 220.0 220.0 34.0
OPA2376AIYZDT DSBGA YZD 8 250 220.0 220.0 34.0
OPA2376AIYZDT DSBGA YZD 8 250 182.0 182.0 17.0
OPA376AIDBVR SOT-23 DBV 5 3000 202.0 201.0 28.0
OPA376AIDBVR SOT-23 DBV 5 3000 195.0 200.0 45.0
OPA376AIDBVT SOT-23 DBV 5 250 195.0 200.0 45.0
OPA376AIDBVT SOT-23 DBV 5 250 202.0 201.0 28.0
OPA376AIDCKR SC70 DCK 5 3000 195.0 200.0 45.0
OPA376AIDCKR SC70 DCK 5 3000 180.0 180.0 18.0
OPA376AIDCKT SC70 DCK 5 250 180.0 180.0 18.0
OPA376AIDCKT SC70 DCK 5 250 195.0 200.0 45.0
OPA376AIDR SOIC D 8 2500 367.0 367.0 35.0
OPA4376AIPWR TSSOP PW 14 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Oct-2013
Pack Materials-Page 2