Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
OPA2343EA/250 VSSOP DGK 8 250 366.0 364.0 50.0
OPA2343EA/2K5 VSSOP DGK 8 2500 366.0 364.0 50.0
OPA2343UA/2K5 SOIC D 8 2500 367.0 367.0 35.0
OPA343NA/250 SOT-23 DBV 5 250 180.0 180.0 18.0
OPA343NA/3K SOT-23 DBV 5 3000 180.0 180.0 18.0
OPA343UA/2K5 SOIC D 8 2500 367.0 367.0 35.0
OPA4343EA/250 SSOP DBQ 16 250 210.0 185.0 35.0
OPA4343EA/2K5 SSOP DBQ 16 2500 367.0 367.0 35.0
OPA4343NA/250 TSSOP PW 14 250 210.0 185.0 35.0
OPA4343NA/2K5 TSSOP PW 14 2500 367.0 367.0 35.0
OPA4343UA/2K5 SOIC D 14 2500 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Jul-2013
Pack Materials-Page 2