Datasheet

1
2
3
4
8
7
6
5
V+
OUTB
-INB
+INB
OUTA
-INA
+INA
V-
Exposed
Thermal
DiePad
on
Underside
(2)
1
2
3
4
8
7
6
5
V+
OUTB
-INB
+INB
OUTA
-INA
+INA
V-
A
B
1
2
3
4
8
7
6
5
NC
(1)
V+
OUT
NC
(1)
NC
(1)
-IN
+IN
V-
1
2
3
5
4
V+
OUT
+IN
V-
-IN
1
2
3
5
4
V+
-IN
OUT
V-
+IN
OPA333
OPA2333
www.ti.com SBOS351D –MARCH 2006–REVISED NOVEMBER 2013
PIN CONFIGURATIONS: OPA333
DBV PACKAGE
DCK PACKAGE
SOT23-5
SC70-5
(TOP VIEW)
(TOP VIEW)
D PACKAGE
SO-8
(TOP VIEW)
(1) NC denotes no internal connection.
PIN CONFIGURATIONS: OPA2333
DRB PACKAGE D AND DGK PACKAGES
DFN-8 (SON-8) SO-8 AND MSOP-8 (VSSOP-8)
(TOP VIEW) (TOP VIEW)
(2) Connect thermal die pad to V–.
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Product Folder Links: OPA333 OPA2333