Datasheet

Processor Family
CC = Embedded RF Radio
MSP = Mixed Signal Processor
XMS = Experimental Silicon
430 MCU Platform TI’s Low Power Microcontroller Platform
Device Type Memory Type
C = ROM
F = Flash
FR = FRAM
G = Flash/FRAM (Value Line)
L = No Nonvolatile Memory
Specialized Application
AFE = Analog Front End
BT = Preprogrammed with Bluetooth
BQ = Contactless Power
CG = ROM Medical
FE = Flash Energy Meter
FG = Flash Medical
FW = Flash Electronic Flow Meter
Series 1 Series = Up to 8 MHz
2 Series = Up to 16 MHz
3 Series = Legacy
4 Series = Up to 16 MHz w/ LCD
5 Series = Up to 25 MHz
6 Series = Up to 25 MHz w/ LCD
0 = Low Voltage Series
Feature Set Various Levels of Integration Within a Series
Optional: A = Revision N/A
Optional: Temperature Range S = 0°C to 50 C
C to 70 C
I = -40 C to 85 C
T = -40 C to 105 C
°
C = 0° °
° °
° °
Packaging
www.ti.com/packaging
Optional: Tape and Reel T = Small Reel (7 inch)
R = Large Reel (11 inch)
No Markings = Tube or Tray
Optional: Additional Features *-EP = Enhanced Product (-40°C to 105°C)
*-HT = Extreme Temperature Parts (-55°C to 150°C)
MSP 430 F 5 438 A I ZQW T XX
Processor Family
Series
Optional: Temperature Range
430 MCU Platform
PackagingDevice Type
Optional: A = Revision
Optional: Tape and Reel
Feature Set
Optional: Additional Features
MSP430FR573x
MSP430FR572x
SLAS639H –JULY 2011–REVISED SEPTEMBER 2013 www.ti.com
Part Number Decoder
Figure 1. Device Nomenclature
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