Datasheet
Table Of Contents
- Features
- Description
- Functional Block Diagram – MSP430F5529IPN, MSP430F5527IPN, MSP430F5525IPN, MSP430F5521IPN
- Pin Designation – MSP430F5529IPN, MSP430F5527IPN, MSP430F5525IPN, MSP430F5521IPN
- Functional Block Diagram – MSP430F5528IRGC, MSP430F5526IRGC, MSP430F5524IRGC, MSP430F5522IRGC MSP430F5528IZQE, MSP430F5526IZQE, MSP430F5524IZQE, MSP430F5522IZQE MSP430F5528IYFF, MSP430F5526IYFF, MSP430F5524IYFF
- Pin Designation – MSP430F5528IRGC, MSP430F5526IRGC, MSP430F5524IRGC, MSP430F5522IRGC
- Functional Block Diagram – MSP430F5519IPN, MSP430F5517IPN, MSP430F5515IPN
- Pin Designation – MSP430F5519IPN, MSP430F5517IPN, MSP430F5515IPN
- Functional Block Diagram – MSP430F5514IRGC, MSP430F5513IRGC, MSP430F5514IZQE, MSP430F5513IZQE
- Pin Designation – MSP430F5514IRGC, MSP430F5513IRGC
- Pin Designation – MSP430F5528IZQE, MSP430F5526IZQE, MSP430F5524IZQE, MSP430F5522IZQE, MSP430F5514IZQE, MSP430F5513IZQE
- Pin Designation – MSP430F5528IYFF, MSP430F5526IYFF, MSP430F5524IYFF
- Short-Form Description
- CPU
- Operating Modes
- Interrupt Vector Addresses
- Memory Organization
- Bootstrap Loader (BSL)
- JTAG Operation
- Flash Memory (Link to User's Guide)
- RAM Memory (Link to User's Guide)
- Peripherals
- Digital I/O (Link to User's Guide)
- Port Mapping Controller (Link to User's Guide)
- Oscillator and System Clock (Link to User's Guide)
- Power Management Module (PMM) (Link to User's Guide)
- Hardware Multiplier (Link to User's Guide)
- Real-Time Clock (RTC_A) (Link to User's Guide)
- Watchdog Timer (WDT_A) (Link to User's Guide)
- System Module (SYS) (Link to User's Guide)
- DMA Controller (Link to User's Guide)
- Universal Serial Communication Interface (USCI) (Links to User's Guide: UART Mode, SPI Mode, I2C Mode)
- TA0 (Link to User's Guide)
- TA1 (Link to User's Guide)
- TA2 (Link to User's Guide)
- TB0 (Link to User's Guide)
- Comparator_B (Link to User's Guide)
- ADC12_A (Link to User's Guide)
- CRC16 (Link to User's Guide)
- REF Voltage Reference (Link to User's Guide)
- USB Universal Serial Bus (Link to User's Guide)
- Embedded Emulation Module (EEM) (Link to User's Guide)
- Peripheral File Map
- Absolute Maximum Ratings
- Thermal Packaging Characteristics
- Recommended Operating Conditions
- Electrical Characteristics
- Active Mode Supply Current Into VCC Excluding External Current
- Low-Power Mode Supply Currents (Into VCC) Excluding External Current
- Schmitt-Trigger Inputs – General Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3, RST/NMI)
- Inputs – Ports P1 and P2 (P1.0 to P1.7, P2.0 to P2.7)
- Leakage Current – General Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3, RST/NMI)
- Outputs – General Purpose I/O (Full Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3)
- Outputs – General Purpose I/O (Reduced Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3)
- Output Frequency – General Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3)
- Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
- Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
- Crystal Oscillator, XT1, Low-Frequency Mode
- Crystal Oscillator, XT2
- Internal Very-Low-Power Low-Frequency Oscillator (VLO)
- Internal Reference, Low-Frequency Oscillator (REFO)
- DCO Frequency
- PMM, Brown-Out Reset (BOR)
- PMM, Core Voltage
- PMM, SVS High Side
- PMM, SVM High Side
- PMM, SVS Low Side
- PMM, SVM Low Side
- Wake-Up From Low-Power Modes and Reset
- Timer_A
- Timer_B
- USCI (UART Mode) Recommended Operating Conditions
- USCI (UART Mode)
- USCI (SPI Master Mode) Recommended Operating Conditions
- USCI (SPI Master Mode)
- USCI (SPI Slave Mode)
- USCI (I2C Mode)
- 12-Bit ADC, Power Supply and Input Range Conditions
- 12-Bit ADC, Timing Parameters
- 12-Bit ADC, Linearity Parameters Using an External Reference Voltage or AVCC as Reference Voltage
- 12-Bit ADC, Linearity Parameters Using the Internal Reference Voltage
- 12-Bit ADC, Temperature Sensor and Built-In VMID
- REF, External Reference
- REF, Built-In Reference
- Comparator_B
- Ports PU.0 and PU.1
- USB Output Ports DP and DM
- USB Input Ports DP and DM
- USB-PWR (USB Power System)
- USB-PLL (USB Phase Locked Loop)
- Flash Memory
- JTAG and Spy-Bi-Wire Interface
- Input/Output Schematics
- Port P1, P1.0 to P1.7, Input/Output With Schmitt Trigger
- Port P2, P2.0 to P2.7, Input/Output With Schmitt Trigger
- Port P3, P3.0 to P3.7, Input/Output With Schmitt Trigger
- Port P4, P4.0 to P4.7, Input/Output With Schmitt Trigger
- Port P5, P5.0 and P5.1, Input/Output With Schmitt Trigger
- Port P5, P5.2, Input/Output With Schmitt Trigger
- Port P5, P5.3, Input/Output With Schmitt Trigger
- Port P5, P5.6 to P5.7, Input/Output With Schmitt Trigger
- Port P6, P6.0 to P6.7, Input/Output With Schmitt Trigger
- Port P7, P7.0 to P7.3, Input/Output With Schmitt Trigger
- Port P7, P7.4 to P7.7, Input/Output With Schmitt Trigger
- Port P8, P8.0 to P8.2, Input/Output With Schmitt Trigger
- Port PU.0/DP, PU.1/DM, PUR USB Ports
- Port J, J.0 JTAG pin TDO, Input/Output With Schmitt Trigger or Output
- Port J, J.1 to J.3 JTAG pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
- Device Descriptors (TLV)
- Revision History
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590L –MARCH 2009–REVISED MAY 2013
www.ti.com
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
Voltage applied at V
CC
to V
SS
–0.3 V to 4.1 V
Voltage applied to any pin (excluding VCORE, VBUS, V18)
(2)
–0.3 V to V
CC
+ 0.3 V
Diode current at any device pin ±2 mA
Storage temperature range, T
stg
(3)
–55°C to 150°C
Maximum operating junction temperature, T
J
95°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to V
SS
. VCORE is for internal device use only. No external DC loading or voltage should be applied.
(3) Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
Thermal Packaging Characteristics
PARAMETER VALUE UNIT
LQFP (PN) 70
Low-K board (JESD51-3) VQFN (RGC) 55
BGA (ZQE) 84
θ
JA
Junction-to-ambient thermal resistance, still air °C/W
LQFP (PN) 45
High-K board (JESD51-7) VQFN (RGC) 25
BGA (ZQE) 46
LQFP (PN) 12
θ
JC
Junction-to-case thermal resistance VQFN (RGC) 12 °C/W
BGA (ZQE) 30
LQFP (PN) 22
θ
JB
Junction-to-board thermal resistance VQFN (RGC) 6 °C/W
BGA (ZQE) 20
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Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513