Datasheet
Table Of Contents
- Features
- Description
- Functional Block Diagram – MSP430F5529IPN, MSP430F5527IPN, MSP430F5525IPN, MSP430F5521IPN
- Pin Designation – MSP430F5529IPN, MSP430F5527IPN, MSP430F5525IPN, MSP430F5521IPN
- Functional Block Diagram – MSP430F5528IRGC, MSP430F5526IRGC, MSP430F5524IRGC, MSP430F5522IRGC MSP430F5528IZQE, MSP430F5526IZQE, MSP430F5524IZQE, MSP430F5522IZQE MSP430F5528IYFF, MSP430F5526IYFF, MSP430F5524IYFF
- Pin Designation – MSP430F5528IRGC, MSP430F5526IRGC, MSP430F5524IRGC, MSP430F5522IRGC
- Functional Block Diagram – MSP430F5519IPN, MSP430F5517IPN, MSP430F5515IPN
- Pin Designation – MSP430F5519IPN, MSP430F5517IPN, MSP430F5515IPN
- Functional Block Diagram – MSP430F5514IRGC, MSP430F5513IRGC, MSP430F5514IZQE, MSP430F5513IZQE
- Pin Designation – MSP430F5514IRGC, MSP430F5513IRGC
- Pin Designation – MSP430F5528IZQE, MSP430F5526IZQE, MSP430F5524IZQE, MSP430F5522IZQE, MSP430F5514IZQE, MSP430F5513IZQE
- Pin Designation – MSP430F5528IYFF, MSP430F5526IYFF, MSP430F5524IYFF
- Short-Form Description
- CPU
- Operating Modes
- Interrupt Vector Addresses
- Memory Organization
- Bootstrap Loader (BSL)
- JTAG Operation
- Flash Memory (Link to User's Guide)
- RAM Memory (Link to User's Guide)
- Peripherals
- Digital I/O (Link to User's Guide)
- Port Mapping Controller (Link to User's Guide)
- Oscillator and System Clock (Link to User's Guide)
- Power Management Module (PMM) (Link to User's Guide)
- Hardware Multiplier (Link to User's Guide)
- Real-Time Clock (RTC_A) (Link to User's Guide)
- Watchdog Timer (WDT_A) (Link to User's Guide)
- System Module (SYS) (Link to User's Guide)
- DMA Controller (Link to User's Guide)
- Universal Serial Communication Interface (USCI) (Links to User's Guide: UART Mode, SPI Mode, I2C Mode)
- TA0 (Link to User's Guide)
- TA1 (Link to User's Guide)
- TA2 (Link to User's Guide)
- TB0 (Link to User's Guide)
- Comparator_B (Link to User's Guide)
- ADC12_A (Link to User's Guide)
- CRC16 (Link to User's Guide)
- REF Voltage Reference (Link to User's Guide)
- USB Universal Serial Bus (Link to User's Guide)
- Embedded Emulation Module (EEM) (Link to User's Guide)
- Peripheral File Map
- Absolute Maximum Ratings
- Thermal Packaging Characteristics
- Recommended Operating Conditions
- Electrical Characteristics
- Active Mode Supply Current Into VCC Excluding External Current
- Low-Power Mode Supply Currents (Into VCC) Excluding External Current
- Schmitt-Trigger Inputs – General Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3, RST/NMI)
- Inputs – Ports P1 and P2 (P1.0 to P1.7, P2.0 to P2.7)
- Leakage Current – General Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3, RST/NMI)
- Outputs – General Purpose I/O (Full Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3)
- Outputs – General Purpose I/O (Reduced Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3)
- Output Frequency – General Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3)
- Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
- Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
- Crystal Oscillator, XT1, Low-Frequency Mode
- Crystal Oscillator, XT2
- Internal Very-Low-Power Low-Frequency Oscillator (VLO)
- Internal Reference, Low-Frequency Oscillator (REFO)
- DCO Frequency
- PMM, Brown-Out Reset (BOR)
- PMM, Core Voltage
- PMM, SVS High Side
- PMM, SVM High Side
- PMM, SVS Low Side
- PMM, SVM Low Side
- Wake-Up From Low-Power Modes and Reset
- Timer_A
- Timer_B
- USCI (UART Mode) Recommended Operating Conditions
- USCI (UART Mode)
- USCI (SPI Master Mode) Recommended Operating Conditions
- USCI (SPI Master Mode)
- USCI (SPI Slave Mode)
- USCI (I2C Mode)
- 12-Bit ADC, Power Supply and Input Range Conditions
- 12-Bit ADC, Timing Parameters
- 12-Bit ADC, Linearity Parameters Using an External Reference Voltage or AVCC as Reference Voltage
- 12-Bit ADC, Linearity Parameters Using the Internal Reference Voltage
- 12-Bit ADC, Temperature Sensor and Built-In VMID
- REF, External Reference
- REF, Built-In Reference
- Comparator_B
- Ports PU.0 and PU.1
- USB Output Ports DP and DM
- USB Input Ports DP and DM
- USB-PWR (USB Power System)
- USB-PLL (USB Phase Locked Loop)
- Flash Memory
- JTAG and Spy-Bi-Wire Interface
- Input/Output Schematics
- Port P1, P1.0 to P1.7, Input/Output With Schmitt Trigger
- Port P2, P2.0 to P2.7, Input/Output With Schmitt Trigger
- Port P3, P3.0 to P3.7, Input/Output With Schmitt Trigger
- Port P4, P4.0 to P4.7, Input/Output With Schmitt Trigger
- Port P5, P5.0 and P5.1, Input/Output With Schmitt Trigger
- Port P5, P5.2, Input/Output With Schmitt Trigger
- Port P5, P5.3, Input/Output With Schmitt Trigger
- Port P5, P5.6 to P5.7, Input/Output With Schmitt Trigger
- Port P6, P6.0 to P6.7, Input/Output With Schmitt Trigger
- Port P7, P7.0 to P7.3, Input/Output With Schmitt Trigger
- Port P7, P7.4 to P7.7, Input/Output With Schmitt Trigger
- Port P8, P8.0 to P8.2, Input/Output With Schmitt Trigger
- Port PU.0/DP, PU.1/DM, PUR USB Ports
- Port J, J.0 JTAG pin TDO, Input/Output With Schmitt Trigger or Output
- Port J, J.1 to J.3 JTAG pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
- Device Descriptors (TLV)
- Revision History
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590L –MARCH 2009–REVISED MAY 2013
www.ti.com
Crystal Oscillator, XT1, Low-Frequency Mode
(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS V
CC
MIN TYP MAX UNIT
f
OSC
= 32768 Hz, XTS = 0, XT1BYPASS = 0,
0.075
XT1DRIVEx = 1, T
A
= 25°C
Differential XT1 oscillator
crystal current consumption f
OSC
= 32768 Hz, XTS = 0, XT1BYPASS = 0,
ΔI
DVCC.LF
3.0 V 0.170 µA
from lowest drive setting, LF XT1DRIVEx = 2, T
A
= 25°C
mode
f
OSC
= 32768 Hz, XTS = 0, XT1BYPASS = 0,
0.290
XT1DRIVEx = 3, T
A
= 25°C
XT1 oscillator crystal
f
XT1,LF0
XTS = 0, XT1BYPASS = 0 32768 Hz
frequency, LF mode
XT1 oscillator logic-level
f
XT1,LF,SW
square-wave input frequency, XTS = 0, XT1BYPASS = 1
(2) (3)
10 32.768 50 kHz
LF mode
XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 0,
210
f
XT1,LF
= 32768 Hz, C
L,eff
= 6 pF
Oscillation allowance for
OA
LF
kΩ
LF crystals
(4)
XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 1,
300
f
XT1,LF
= 32768 Hz, C
L,eff
= 12 pF
XTS = 0, XCAPx = 0
(6)
2
XTS = 0, XCAPx = 1 5.5
Integrated effective load
C
L,eff
pF
capacitance, LF mode
(5)
XTS = 0, XCAPx = 2 8.5
XTS = 0, XCAPx = 3 12.0
XTS = 0, Measured at ACLK,
Duty cycle, LF mode 30 70 %
f
XT1,LF
= 32768 Hz
Oscillator fault frequency,
f
Fault,LF
XTS = 0
(8)
10 10000 Hz
LF mode
(7)
f
OSC
= 32768 Hz, XTS = 0, XT1BYPASS = 0,
1000
XT1DRIVEx = 0, T
A
= 25°C, C
L,eff
= 6 pF
t
START,LF
Startup time, LF mode 3.0 V ms
f
OSC
= 32768 Hz, XTS = 0, XT1BYPASS = 0,
500
XT1DRIVEx = 3, T
A
= 25°C, C
L,eff
= 12 pF
(1) To improve EMI on the XT1 oscillator, the following guidelines should be observed.
(a) Keep the trace between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
(d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive or resistive leakage between the oscillator pins.
(2) When XT1BYPASS is set, XT1 circuits are automatically powered down. Input signal is a digital square wave with parametrics defined in
the Schmitt-trigger Inputs section of this data sheet.
(3) Maximum frequency of operation of the entire device cannot be exceeded.
(4) Oscillation allowance is based on a safety factor of 5 for recommended crystals. The oscillation allowance is a function of the
XT1DRIVEx settings and the effective load. In general, comparable oscillator allowance can be achieved based on the following
guidelines, but should be evaluated based on the actual crystal selected for the application:
(a) For XT1DRIVEx = 0, C
L,eff
≤ 6 pF.
(b) For XT1DRIVEx = 1, 6 pF ≤ C
L,eff
≤ 9 pF.
(c) For XT1DRIVEx = 2, 6 pF ≤ C
L,eff
≤ 10 pF.
(d) For XT1DRIVEx = 3, C
L,eff
≥ 6 pF.
(5) Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
(6) Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
(7) Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies in between might set the flag.
(8) Measured with logic-level input frequency but also applies to operation with crystals.
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Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513