Datasheet

MSP430F5438, MSP430F5437, MSP430F5436, MSP430F5435
MSP430F5419, MSP430F5418
SLAS612D –AUGUST 2009–REVISED AUGUST 2013 www.ti.com
Crystal Oscillator, XT1, High-Frequency Mode
(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS V
CC
MIN TYP MAX UNIT
f
OSC
= 4 MHz,
XTS = 1, XOSCOFF = 0,
200
XT1BYPASS = 0, XT1DRIVEx = 0,
T
A
= 25°C
f
OSC
= 12 MHz,
XTS = 1, XOSCOFF = 0,
260
XT1BYPASS = 0, XT1DRIVEx = 1,
T
A
= 25°C
XT1 oscillator crystal current HF
I
DVCC.HF
3.0 V µA
mode
f
OSC
= 20 MHz,
XTS = 1, XOSCOFF = 0,
325
XT1BYPASS = 0, XT1DRIVEx = 2,
T
A
= 25°C
f
OSC
= 32 MHz,
XTS = 1, XOSCOFF = 0,
450
XT1BYPASS = 0, XT1DRIVEx = 3,
T
A
= 25°C
XT1 oscillator crystal frequency, XTS = 1,
f
XT1,HF0
4 8 MHz
HF mode 0 XT1BYPASS = 0, XT1DRIVEx = 0
(2)
XT1 oscillator crystal frequency, XTS = 1,
f
XT1,HF1
8 16 MHz
HF mode 1 XT1BYPASS = 0, XT1DRIVEx = 1
(2)
XT1 oscillator crystal frequency, XTS = 1,
f
XT1,HF2
16 24 MHz
HF mode 2 XT1BYPASS = 0, XT1DRIVEx = 2
(2)
XT1 oscillator crystal frequency, XTS = 1,
f
XT1,HF3
24 32 MHz
HF mode 3 XT1BYPASS = 0, XT1DRIVEx = 3
(2)
XT1 oscillator logic-level square-
XTS = 1,
f
XT1,HF,SW
wave input frequency, HF mode, 1.5 32 MHz
XT1BYPASS = 1
(3) (2)
bypass mode
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 0, 450
f
XT1,HF
= 6 MHz, C
L,eff
= 15 pF
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 1, 320
f
XT1,HF
= 12 MHz, C
L,eff
= 15 pF
Oscillation allowance for
OA
HF
Ω
HF crystals
(4)
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 2, 200
f
XT1,HF
= 20 MHz, C
L,eff
= 15 pF
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 3, 200
f
XT1,HF
= 32 MHz, C
L,eff
= 15 pF
f
OSC
= 6 MHz, XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 0, 0.5
T
A
= 25°C, C
L,eff
= 15 pF
t
START,HF
Startup time, HF mode 3.0 V ms
f
OSC
= 20 MHz, XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 2, 0.3
T
A
= 25°C, C
L,eff
= 15 pF
(1) To improve EMI on the XT1 oscillator the following guidelines should be observed.
(a) Keep the traces between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
(d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
(e) Use assembly materials and techniques to avoid any parasitic load on the oscillator XIN and XOUT pins.
(f) If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.
(2) This represents the maximum frequency that can be input to the device externally. Maximum frequency achievable on the device
operation is based on the frequencies present on ACLK, MCLK, and SMCLK cannot be exceed for a given range of operation.
(3) When XT1BYPASS is set, XT1 circuits are automatically powered down. Input signal is a digital square wave with parametrics defined in
the Schmitt-Trigger Inputs section of this data sheet.
(4) Oscillation allowance is based on a safety factor of 5 for recommended crystals.
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