Datasheet

MSP430F21x2

SLAS578J –NOVEMBER 2007– REVISED JANUARY 2012

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

Table 1. Available Options

PACKAGED DEVICES

(1)(2)

PLASTIC 28-PIN TSSOP (PW) PLASTIC 32-PIN QFN (RHB) PLASTIC 32-PIN QFN (RTV)

MSP430F2112IPW MSP430F2112IRHB MSP430F2112IRTV

-40°C to 85°C MSP430F2122IPW MSP430F2122IRHB MSP430F2122IRTV

MSP430F2132IPW MSP430F2132IRHB MSP430F2132IRTV

MSP430F2112TPW MSP430F2112TRHB MSP430F2112TRTV

-40°C to 105°C MSP430F2122TPW MSP430F2122TRHB MSP430F2122TRTV

MSP430F2132TPW MSP430F2132TRHB MSP430F2132TRTV

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

Development Tool Support

All MSP430 microcontrollers include an Embedded Emulation Module (EEM) that allows advanced debugging

and programming through easy-to-use development tools. Recommended hardware options include:

• Debugging and Programming Interface

– MSP-FET430UIF (USB)

– MSP-FET430PIF (Parallel Port)

• Debugging and Programming Interface with Target Board

– MSP-FET430U28 (PW package)

• Production Programmer

– MSP-GANG430