Datasheet

MSP430x12x
MIXED SIGNAL MICROCONTROLLER
SLAS312C − JULY 2001 − REVISED SEPTEMBER 2004
12
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
peripheral file map (continued)
PERIPHERALS WITH BYTE ACCESS (CONTINUED)
Special Function Module enable2
Module enable1
SFR interrupt flag2
SFR interrupt flag1
SFR interrupt enable2
SFR interrupt enable1
ME2
ME1
IFG2
IFG1
IE2
IE1
005h
004h
003h
002h
001h
000h
absolute maximum ratings
†
Voltage applied at V
CC
to V
SS
−0.3 V to 4.1 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage applied to any pin (see Note) −0.3 V to V
CC
+0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Diode current at any device terminal ±2 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, T
stg
(unprogrammed device) −55°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, T
stg
(programmed device) −40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE: All voltages referenced to V
SS
. The JTAG fuse-blow voltage, V
FB
, is allowed to exceed the absolute maximum rating. The voltage is applied
to the TEST pin when blowing the JTAG fuse.
recommended operating conditions
MIN NOM MAX UNITS
Supply voltage during program execution V (see Note 1)
18
36
V
Supply voltage during program execution, V
CC
(see Note 1) 1.8 3.6 V
Supply voltage during program/erase flash memory, V
CC
2.7 3.6 V
Supply voltage, V
SS
0 V
Operating free-air temperature range, T
A
−40 85 °C
LFXT1 t l f f
LF mode selected, XTS=0 Watch crystal 32768 Hz
LFXT1 crystal frequency, f
(LFXT1)
(see Note 2)
XT1 selected mode XTS 1
Ceramic resonator 450 8000
kHz
(
see
N
o
t
e
2)
XT1 selected mode, XTS=1
Crystal 1000 8000
kHz
Processor frequency f (MCLK signal)
V
CC
= 1.8 V dc 4.15
MHz
Processor frequency f
(system)
(MCLK signal)
V
CC
= 3.6 V dc 8
MHz
NOTES: 1. The LFXT1 oscillator in LF-mode requires a resistor of 5.1 MΩ from XOUT to V
SS
when V
CC
<2.5 V. The LFXT1 oscillator in
XT1-mode accepts a ceramic resonator or a crystal frequency of 4 MHz at V
CC
≥ 2.2 V. The LFXT1 oscillator in XT1-mode accepts
a ceramic resonator or a crystal frequency of 8 MHz at V
CC
≥ 2.8 V.
2. The LFXT1 oscillator in LF-mode requires a watch crystal. The LFXT1 oscillator in XT1-mode accepts a ceramic resonator or crystal.
1.8 V 3.6 V2.7 V 3 V
4.15 MHz
8.0 MHz
Supply Voltage − V
Supply voltage range, ’F12x,
during flash memory programming
Supply voltage range,
’F12x, during
program execution
NOTE: Minimum processor frequency is defined by system clock. Flash program or erase operations require a minimum V
CC
of 2.7 V.
f
(system)
(MHz)
Figure 1. Frequency vs Supply Voltage, MSP430F12x