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 ±  

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SLLS408G − JANUARY 2000 − REVISED MARCH 2004

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

D RS-232 Bus-Pin ESD Protection Exceeds

±15 kV Using Human-Body Model (HBM)

D Meets or Exceeds the Requirements of

TIA/EIA-232-F and ITU v.28 Standards

D Operates With 3-V to 5.5-V V

Supply

D Operates Up To 250 kbit/s

D Two Drivers and Two Receivers

D Low Standby Current...1 µA Typical

D External Capacitors ...4 × 0.1 µF

D Accepts 5-V Logic Input With 3.3-V Supply

D Alternative High-Speed Pin-Compatible

Device (1 Mbit/s)

− SNx5C3222

D Applications

− Battery-Powered Systems, PDAs,

Notebooks, Laptops, Palmtop PCs, and

Hand-Held Equipment

description/ordering information

The MAX3222 consists of two line drivers, two line receivers, and a dual charge-pump circuit with

±15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the

requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication

controller and the serial-port connector. The charge pump and four small external capacitors allow operation

from a single 3-V to 5.5-V supply. The device operates at data signaling rates up to 250 kbit/s and a maximum

of 30-V/µs driver output slew rate.

ORDERING INFORMATION

PACKAGE

†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

SOIC (DW)

Tube of 25 MAX3222CDW

MAX3222C

SOIC (DW)

Reel of 2000 MAX3222CDWR

MAX3222C

−0°C to 70°C

SSOP (DB)

Tube of 70 MAX3222CDB

MA3222C

−0°C to 70°C SSOP (DB)

Reel of 2000 MAX3222CDBR

MA3222C

TSSOP (PW)

Tube of 70 MAX3222CPW

MA3222C

TSSOP (PW)

Reel of 2000 MAX3222CPWR

MA3222C

SOIC (DW)

Tube of 25 MAX3222IDW

MAX3222I

SOIC (DW)

Reel of 2000 MAX3222IDWR

MAX3222I

−40°C to 85°C

SSOP (DB)

Tube of 70 MAX3222IDB

MB3222I

−40°C to 85°C SSOP (DB)

Reel of 2000 MAX3222IDBR

MB3222I

TSSOP (PW)

Tube of 70 MAX3222IPW

MB3222I

TSSOP (PW)

Reel of 2000 MAX3222IPWR

MB3222I

†

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are

available at www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

DB, DW, OR PW PACKAGE

(TOP VIEW)

C1+

V+

C1−

C2+

C2−

V−

DOUT2

RIN2

ROUT2

PWRDOWN

GND

DOUT1

RIN1

ROUT1

DIN1

DIN2

NC − No internal connection

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Summary of content (18 pages)

PAGE 1
± SLLS408G − JANUARY 2000 − REVISED MARCH 2004 D RS-232 Bus-Pin ESD Protection Exceeds D D D D D D D D D DB, DW, OR PW PACKAGE (TOP VIEW) ±15 kV Using Human-Body Model (HBM) Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates With 3-V to 5.5-V VCC Supply Operates Up To 250 kbit/s Two Drivers and Two Receivers Low Standby Current . . . 1 µA Typical External Capacitors . . . 4 × 0.
PAGE 2
± SLLS408G − JANUARY 2000 − REVISED MARCH 2004 description/ordering information (continued) The MAX3222 can be placed in the power-down mode by setting PWRDOWN low, which draws only 1 µA from the power supply. When the device is powered down, the receivers remain active while the drivers are placed in the high-impedance state.
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± SLLS408G − JANUARY 2000 − REVISED MARCH 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V Positive output supply voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.
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± SLLS408G − JANUARY 2000 − REVISED MARCH 2004 DRIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 5) PARAMETER TEST CONDITIONS MIN TYP† VOH VOL High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 5.4 Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC −5 −5.
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± SLLS408G − JANUARY 2000 − REVISED MARCH 2004 RECEIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 5) PARAMETER VOH VOL TEST CONDITIONS High-level output voltage IOH = −1 mA IOL = 1.6 mA Low-level output voltage VIT+ Positive-going input threshold voltage VCC = 3.
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± SLLS408G − JANUARY 2000 − REVISED MARCH 2004 PARAMETER MEASUREMENT INFORMATION 3V Input Generator (see Note B) 1.5 V RS-232 Output 50 Ω RL 1.5 V 0V CL (see Note A) 3V PWRDOWN tTHL tTLH VOH 3V 3V Output −3 V −3 V VOL TEST CIRCUIT VOLTAGE WAVEFORMS SR(tr) + t THL 6V or t TLH NOTES: A. CL includes probe and jig capacitance. B.
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± SLLS408G − JANUARY 2000 − REVISED MARCH 2004 PARAMETER MEASUREMENT INFORMATION VCC S1 GND RL Output 3 V or 0 V CL (see Note A) EN 3V Input 1.5 V 0V tPZH (S1 at GND) tPHZ S1 at GND) VOH Output 50% 0.3 V Generator (see Note B) 1.5 V 50 Ω tPLZ (S1 at VCC) 0.3 V Output 50% VOL tPZL (S1 at VCC) TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B.
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± SLLS408G − JANUARY 2000 − REVISED MARCH 2004 APPLICATION INFORMATION 1 EN 2 + C1 − 3 C3† + 20 Powerdown VCC C1+ V+ GND PWRDOWN 19 18 + C BYPASS − = 0.1 µF − 4 5 17 C1− 16 C2+ DOUT1 RIN1 + C2 − 6 7 C4 DOUT2 RIN2 ROUT2 − 15 C2− 14 V− ROUT1 NC + 8 13 9 12 10 11 DIN1 DIN2 NC † C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device MAX3222CDBR Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 MAX3222CDWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 MAX3222CPWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.
PAGE 12
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MAX3222CDBR SSOP DB 20 2000 367.0 367.0 38.0 MAX3222CDWR SOIC DW 20 2000 367.0 367.0 45.0 MAX3222CPWR TSSOP PW 20 2000 367.0 367.0 38.0 MAX3222IDBR SSOP DB 20 2000 367.0 367.0 38.0 MAX3222IDWR SOIC DW 20 2000 367.0 367.0 45.0 MAX3222IPWR TSSOP PW 20 2000 367.0 367.0 38.
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MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.