Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
MAX3222ECDBR SSOP DB 20 2000 367.0 367.0 38.0
MAX3222ECDWR SOIC DW 20 2000 367.0 367.0 45.0
MAX3222ECPWR TSSOP PW 20 2000 367.0 367.0 38.0
MAX3222EIDBR SSOP DB 20 2000 367.0 367.0 38.0
MAX3222EIDWR SOIC DW 20 2000 367.0 367.0 45.0
MAX3222EIPWR TSSOP PW 20 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2