Datasheet

LP5907
www.ti.com SNVS798G –APRIL 2012 – REVISED OCTOBER 2013
ABSOLUTE MAXIMUM RATINGS
(1)(2)(3)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
IN
Input voltage –0.3 6 V
V
OUT
Output voltage –0.3 to (V
IN
+ 0.3 V) 6 V
V
EN
Enable input voltage –0.3 to (V
IN
+ 0.3 V) 6 V
Continuous power dissipation
(3)
Internally Limited
Junction temperature (T
JMAX
) 150 °C
Storage temperature range –65 150 °C
Maximum lead temperature (soldering, 10 seconds) 260 °C
Human body model 2 kV
ESD rating
(4)
Machine model 200 V
(1) If Military or Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability
and specifications.
(2) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(3) Internal thermal shutdown circuitry protects the device from permanent damage.
(4) The Human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. The machine model is a 200-pF
capacitor discharged directly into each pin. MIL-STD-883 3015.7
OPERATING RATINGS
(1)(2)
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
IN
Input voltage range 2.2 5.5 V
V
EN
Enable voltage range 0 to (V
IN
+ 0.3) 5.5 V
Recommended load current
(3)
0 250 mA
T
J
Junction temperature range –40 +125 °C
T
A
Ambient temperature range
(3)
–40 +85 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pin.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX-OP
=
125°C), the maximum power dissipation of the device in the application (P
D-MAX
), and the junction-to ambient thermal resistance of the
part/package in the application (θ
JA
), as given by the following equation: T
A-MAX
= T
J-MAX-OP
– (θ
JA
× P
D-MAX
). See APPLICATION
INFORMATION.
THERMAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DSBGA 119.6
JEDEC board
(2)
SOT-23 188.8
Junction to ambient thermal
θ
JA
°C/W
resistance
(1)
X2SON 216.1
4L cellphone board DSBGA 186.5
(1) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design.
(2) Detailed description of the board can be found in JESD51-7
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