Datasheet

1
2
34
VO
UT
GND
VIN
EN
5
N/C
1
2
3
5
4
EN
GND
VIN
VOUT
SVA-30180519
B2B1
A2A
1
V
OUT
GND
V
IN
V
EN
B2 B1
A
2 A1
V
OUT
GND
V
IN
V
EN
TOP VIEW
BO
TTOM VIEW
SVA-30180502
LP5907
SNVS798G –APRIL 2012 – REVISED OCTOBER 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
CONNECTION DIAGRAMS
4-Bump Ultra-Thin DSBGA Package
5-Pin SOT-23 Package
(Top View)
4-pin X2SON Package
(Bottom View)
PIN DESCRIPTIONS
DSBGA SOT-23
NAME X2SON DESCRIPTION
PIN NO. PIN NO.
VIN 4 A1 1 Input voltage supply. A 1-µF capacitor should be connected at this input.
Output voltage. A 1-µF Low ESR capacitor should be connected to this pin. Connect this
VOUT 1 A2 5 output to the load circuit. An internal 280-Ω discharge resistor prevents a charge
remaining on V
OUT
when V
EN
is low.
V
EN
N/A B1 N/A
Enable input; disables the regulator when ≤ 0.4 V. Enables the regulator when ≥ 1.2 V. An
internal 1-MΩ pulldown resistor connects this input to ground.
EN 3 N/A 3
GND 2 B2 2 Common ground
N/C N/A N/A 4 No connect pin
Thermal
5 N/A N/A Thermal pad for X2SON package, connect to GND or Floating.
Pad
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