Datasheet

LP38852
www.ti.com SNVS482E –JANUARY 2007–REVISED APRIL 2013
Absolute Maximum Ratings
(1)(2)
Storage Temperature Range −65°C to +150°C
Lead Temperature Soldering, 5 seconds 260°C
ESD Rating Human Body Model
(3)
±2 kV
Power Dissipation
(4)
Internally Limited
V
IN
Supply Voltage (Survival) −0.3V to +6.0V
V
BIAS
Supply Voltage (Survival) −0.3V to +6.0V
V
SS
SoftStart Voltage (Survival) −0.3V to +6.0V
V
OUT
Voltage (Survival) −0.3V to +6.0V
I
OUT
Current (Survival) Internally Limited
Junction Temperature −40°C to +150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and conditions,
see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The human body model is a 100 pF capacitor discharged through a 1.5k resistor into each pin. Test method is per JESD22-A114.
(4) Device power dissipation must be de-rated based on device power dissipation (P
D
), ambient temperature (T
A
), and package junction to
ambient thermal resistance (θ
JA
). Additional heat-sinking may be required to ensure that the device junction temperature (T
J
) does not
exceed the maximum operating rating. See the Application Information section for details.
Operating Ratings
(1)
V
IN
Supply Voltage (V
OUT
+ V
DO
) to V
BIAS
0.8V ≤ V
OUT
≤ 1.2V 3.0V to 5.5V
V
BIAS
Supply Voltage
(2)
1.2V < V
OUT
≤ 1.8V 4.5V to 5.5V
V
EN
Voltage 0.0V to V
BIAS
I
OUT
0 mA to 1.5A
Junction Temperature Range
(3)
−40°C to +125°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and conditions,
see the Electrical Characteristics.
(2) V
IN
cannot exceed either V
BIAS
or 4.5V, whichever value is lower.
(3) Device power dissipation must be de-rated based on device power dissipation (P
D
), ambient temperature (T
A
), and package junction to
ambient thermal resistance (θ
JA
). Additional heat-sinking may be required to ensure that the device junction temperature (T
J
) does not
exceed the maximum operating rating. See the Application Information section for details.
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