Datasheet

LP2995
+
+
V
TT
PV
IN
V
DDQ
V
REF
GND
AV
IN
V
SENSE
V
DDQ
V
DD
V
TT
V
REF
C
OUT
C
IN
0 100 200 300 400 500 600
AIRFLOW (Linear Feet Per Minute)
45
46
47
48
49
50
51
q
JA
(
o
C/W)
0 1 2 3 4
NUMBER OF VIAS
40
50
60
70
80
90
100
T
JA
(qC/W)
LP2995
SNVS190M –FEBRUARY 2002–REVISED MARCH 2013 www.ti.com
Figure 15. WQFN-16 θ
JA
vs # of Vias (4 Layer JEDEC Board))
Additional improvements in lowering the θ
JA
can also be achieved with a constant airflow across the package.
Maintaining the same conditions as above and utilizing the 2x2 via array, Figure 16 shows how the θ
JA
varies
with airflow.
Figure 16. θ
JA
vs Airflow Speed (JEDEC Board with 4 Vias)
Typical Application Circuits
The typical application circuit used for SSTL-2 termination schemes with DDR-SDRAM can be seen in Figure 17.
Figure 17. SSTL-2 Implementation
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