Datasheet

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LP2951ACSDX-3.3/NOPB WSON NGT 8 4500 367.0 367.0 35.0
LP2951ACSDX/NOPB WSON NGT 8 4500 367.0 367.0 35.0
LP2951CMM VSSOP DGK 8 1000 210.0 185.0 35.0
LP2951CMM-3.0/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LP2951CMM-3.3/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LP2951CMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LP2951CMMX VSSOP DGK 8 3500 367.0 367.0 35.0
LP2951CMMX-3.0/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LP2951CMMX-3.3 VSSOP DGK 8 3500 367.0 367.0 35.0
LP2951CMMX-3.3/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LP2951CMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LP2951CMX SOIC D 8 2500 367.0 367.0 35.0
LP2951CMX-3.0/NOPB SOIC D 8 2500 367.0 367.0 35.0
LP2951CMX-3.3 SOIC D 8 2500 367.0 367.0 35.0
LP2951CMX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0
LP2951CMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LP2951CSD-3.0/NOPB WSON NGT 8 1000 210.0 185.0 35.0
LP2951CSD-3.3/NOPB WSON NGT 8 1000 210.0 185.0 35.0
LP2951CSD/NOPB WSON NGT 8 1000 210.0 185.0 35.0
LP2951CSDX-3.0/NOPB WSON NGT 8 4500 367.0 367.0 35.0
LP2951CSDX-3.3/NOPB WSON NGT 8 4500 367.0 367.0 35.0
LP2951CSDX/NOPB WSON NGT 8 4500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 4