Datasheet

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMV932MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMV932MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LMV932Q1MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMV934MAX SOIC D 14 2500 367.0 367.0 35.0
LMV934MAX/NOPB SOIC D 14 2500 367.0 367.0 35.0
LMV934MTX TSSOP PW 14 2500 367.0 367.0 35.0
LMV934MTX/NOPB TSSOP PW 14 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Nov-2013
Pack Materials-Page 3