Datasheet

LMV761, LMV762
www.ti.com
SNOS998H FEBRUARY 2002REVISED MARCH 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
Human Body Model 2000V
ESD Tolerance
(3)
Machine Model 200V
Supply Voltage (V
+
– V
) 5.5V
Differential Input Voltage Supply Voltage
Voltage between any two pins Supply Voltage
Output Short Circuit Duration
(4)
Current at Input Pin ±5 mA
Infrared or Convection (20 sec.) 235°C
Soldering Information
Wave Soldering (10 sec.) 260°C (Lead Temp)
Junction Temperature 150°C
Storage Temperature Range 65°C to 150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test condition,
see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Unless otherwise specified human body model is 1.5k in series with 100pF. Machine model 200pF.
(4) Applies to both single supply and split supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output current in excess of ±25 mA over long term may adversely
affect reliability.
Operating Ratings
Supply Voltage (V
+
– V
) 2.7V to 5.25V
Temperature Range 40°C to +125°C
6-Pin SOT-23 265°C/W
Package Thermal Resistance
(1)
8-Pin SOIC 190°C/W
8-Pin VSSOP 235°C/W
(1) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
-T
A
)θ
JA
. All numbers apply for packages soldered directly into a PC board.
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