Datasheet

IN+
IN−
OUT
GND
R1
Q1
Q3
Q7Q6
V
CC+
Q2
Q4 Q5
R2
R3
Q8
Q9
+
–
IN–
IN+
OUT
LMV331 SINGLE
LMV393 DUAL
LMV339 QUAD
SLCS136S –AUGUST 1999–REVISED OCTOBER 2012 www.ti.com
ORDERING INFORMATION
(1)
TOP-SIDE
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER
MARKING
(3)
Reel of 3000 LMV331IDCKR
SC-70 – DCK R2_
Reel of 250 LMV331IDCKT
Single
Reel of 3000 LMV331IDBVR
SOT23-5 – DBV R1I_
Reel of 250 LMV331IDBVT
MSOP/VSSOP – DGK Reel of 2500 LMV393IDGKR R9_
Tube of 75 LMV393ID
SOIC – D MV393I
Reel of 2500 LMV393IDR
Dual
–40°C to 125°C Tube of 90 LMV393IPW
TSSOP – PW MV393I
Reel of 2000 LMV393IPWR
VSSOP – DDU Reel of 3000 LMV393IDDUR RABR
Tube of 50 LMV339ID
SOIC – D LM339I
Reel of 2500 LMV339IDR
Quad Tube of 150 LMV339IPW
TSSOP – PW MV339I
Reel of 2000 LMV339IPWR
µQFN – RUC Reel of 3000 LMV339IRUCR RT_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DBV/DCK/DGK/RUC : The actual top-side marking has one additional character that designates the wafer fab/assembly site.
SYMBOL (EACH COMPARATOR)
SIMPLIFIED SCHEMATIC
2 Submit Documentation Feedback Copyright © 1999–2012, Texas Instruments Incorporated