Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM75BIMM-3 VSSOP DGK 8 1000 210.0 185.0 35.0
LM75BIMM-3/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LM75BIMM-5 VSSOP DGK 8 1000 210.0 185.0 35.0
LM75BIMM-5/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LM75BIMMX-3 VSSOP DGK 8 3500 367.0 367.0 35.0
LM75BIMMX-3/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LM75BIMMX-5/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LM75BIMX-3 SOIC D 8 2500 367.0 367.0 35.0
LM75BIMX-3/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM75BIMX-5 SOIC D 8 2500 367.0 367.0 35.0
LM75BIMX-5/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 2