Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM258ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM258ADGKR VSSOP DGK 8 2500 332.0 358.0 35.0
LM258ADR SOIC D 8 2500 367.0 367.0 35.0
LM258ADR SOIC D 8 2500 340.5 338.1 20.6
LM258ADRG4 SOIC D 8 2500 367.0 367.0 35.0
LM258DGKR VSSOP DGK 8 2500 332.0 358.0 35.0
LM258DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM258DR SOIC D 8 2500 367.0 367.0 35.0
LM258DR SOIC D 8 2500 364.0 364.0 27.0
LM258DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM258DRG4 SOIC D 8 2500 367.0 367.0 35.0
LM258DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM2904AVQPWR TSSOP PW 8 2000 367.0 367.0 35.0
LM2904AVQPWRG4 TSSOP PW 8 2000 367.0 367.0 35.0
LM2904DGKR VSSOP DGK 8 2500 332.0 358.0 35.0
LM2904DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM2904DR SOIC D 8 2500 340.5 338.1 20.6
LM2904DR SOIC D 8 2500 367.0 367.0 35.0
LM2904DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM2904DRG4 SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 13-Nov-2013
Pack Materials-Page 3