Datasheet

SOT-223 DDPAK/TO-263
LM340-N, LM78xx
SNOSBT0I –FEBRUARY 2000–REVISED MARCH 2013 www.ti.com
ΔI
Q
= 1.3 mA over line and load changes.
Figure 3. Current Regulator Figure 4. Comparison between SOT-223 and
DDPAK/TO-263 Packages
Scale 1:1
Connection Diagrams
Figure 5. DDPAK/TO-263 Surface-Mount Package Figure 6. 3-Lead SOT-223
Top View Top View
See Package Number KTT0003B See Package Number DCY
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)(3)
DC Input Voltage 35V
Internal Power Dissipation
(4)
Internally Limited
Maximum Junction Temperature 150°C
Storage Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 10 sec.) TO-3 Package (NDS) 300°C
TO-220 Package (NDE), DDPAK/TO-263
Package (KTT) 230°C
ESD Susceptibility
(5)
2 kV
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which
the device functions but the specifications might not be ensured. For ensured specifications and test conditions see the Electrical
Characteristics.
(2) Military datasheets are available upon request. At the time of printing, the military datasheet specifications for the LM140K-5.0/883,
LM140K-12/883, and LM140K-15/883 complied with the min and max limits for the respective versions of the LM140. The LM140H and
LM140K may also be procured as JAN devices on slash sheet JM38510/107.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(4) The maximum allowable power dissipation at any ambient temperature is a function of the maximum junction temperature for operation
(T
JMAX
= 125°C or 150°C), the junction-to-ambient thermal resistance (θ
JA
), and the ambient temperature (T
A
). P
DMAX
= (T
JMAX
−
T
A
)/θ
JA
. If this dissipation is exceeded, the die temperature will rise above T
JMAX
and the electrical specifications do not apply. If the die
temperature rises above 150°C, the device will go into thermal shutdown. For the TO-3 package (NDS), the junction-to-ambient thermal
resistance (θ
JA
) is 39°C/W. When using a heatsink, θ
JA
is the sum of the 4°C/W junction-to-case thermal resistance (θ
JC
) of the TO-3
package and the case-to-ambient thermal resistance of the heatsink. For the TO-220 package (NDE), θ
JA
is 54°C/W and θ
JC
is 4°C/W. If
SOT-223 is used, the junction-to-ambient thermal resistance is 174°C/W and can be reduced by a heatsink (see Applications Hints on
heatsinking).If the DDPAK\TO-263 package is used, the thermal resistance can be reduced by increasing the PC board copper area
thermally connected to the package: Using 0.5 square inches of copper area, θ
JA
is 50°C/W; with 1 square inch of copper area, θ
JA
is
37°C/W; and with 1.6 or more inches of copper area, θ
JA
is 32°C/W.
(5) ESD rating is based on the human body model, 100 pF discharged through 1.5 kΩ.
Operating Conditions
(1)
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which
the device functions but the specifications might not be ensured. For ensured specifications and test conditions see the Electrical
Characteristics.
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