Datasheet

SW
1
RON
2
VIN
3
BOOT
4
VCC
8
GND
7
DIM
6
CS
5
SW
1
RON
2
VIN
3
BOOT
4
VCC
8
GND
7
DIM
6
CS
5
DAP
LM3404, LM3404HV
SNVS465F –OCTOBER 2006–REVISED MAY 2013 www.ti.com
Connection Diagrams
Figure 1. 8-Lead Plastic SOIC-8 Package Figure 2. 8-Lead Plastic So PowerPAD-8 Package
PIN DESCRIPTIONS
Pin(s) Name Description Application Information
1 SW Switch pin Connect this pin to the output inductor and Schottky diode.
2 BOOT MOSFET drive bootstrap pin Connect a 10 nF ceramic capacitor from this pin to SW.
3 DIM Connect a logic-level PWM signal to this pin to enable/disable the power
Input for PWM dimming
MOSFET and reduce the average light output of the LED array.
4 GND Ground pin Connect this pin to system ground.
5 CS Set the current through the LED array by connecting a resistor from this pin to
Current sense feedback pin
ground.
6 RON On-time control pin A resistor connected from this pin to VIN sets the regulator controlled on-time.
7 VCC Output of the internal 7V linear Bypass this pin to ground with a minimum 0.1 µF ceramic capacitor with X5R or
regulator X7R dielectric.
8 VIN Nominal operating input range for this pin is 6V to 42V (LM3404) or 6V to 75V
Input voltage pin
(LM3404HV).
DAP GND Thermal Pad Connect to ground. Place 4-6 vias from DAP to bottom layer ground plane.
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Product Folder Links: LM3404 LM3404HV