Datasheet

LM117, LM317A, LM317-N
SNVS774O –MAY 2004–REVISED JANUARY 2014 www.ti.com
LM317A and LM317-N ELECTRICAL CHARACTERISTICS
(1)
Specifications with standard type face are for T
J
= 25°C, and those with boldface type apply over full Operating
Temperature Range. Unless otherwise specified, V
IN
− V
OUT
= 5V, and I
OUT
= 10 mA.
LM317A LM317-N
Parameter Conditions
Unit
Min Typ Max Min Typ Max
s
1.238 1.250 1.262 - 1.25 - V
Reference Voltage
3V ≤ (V
IN
− V
OUT
) ≤ 40V,
1.225 1.250 1.270 1.20 1.25 1.30 V
10 mA ≤ I
OUT
≤ I
MAX
(1)
0.005 0.01 0.01 0.04
Line Regulation 3V ≤ (V
IN
− V
OUT
) ≤ 40V
(2)
%/V
0.01 0.02 0.02 0.07
0.1 0.5 0.1 0.5
Load Regulation 10 mA ≤ I
OUT
≤ I
MAX
(1) (2)
%
0.3 1 0.3 1.5
Thermal Regulation 20 ms Pulse 0.04 0.07 0.04 0.07 %/W
Adjustment Pin Current 50 100 50 100 μA
Adjustment Pin Current 10 mA ≤ I
OUT
≤ I
MAX
(1)
0.2 5 0.2 5 μA
Change 3V ≤ (V
IN
− V
OUT
) ≤ 40V
Temperature Stability T
MIN
≤ T
J
≤ T
MAX
1 1 %
Minimum Load Current (V
IN
− V
OUT
) = 40V 3.5 10 3.5 10 mA
NDS, KTT Packages - - - 1.5 2.2 3.4
(V
IN
− V
OUT
) ≤ 15V DCY, NDE Packages 1.5 2.2 3.4 1.5 2.2 3.4 A
NDT Package 0.5 0.8 1.8 0.5 0.8 1.8
Current Limit
NDS, KTT Packages - - 0.15 0.40
(V
IN
− V
OUT
) = 40V DCY, NDE Packages 0.15 0.40 0.15 0.40 A
NDT Package 0.075 0.20 0.075 0.20
RMS Output Noise, % of
10 Hz ≤ f ≤ 10 kHz 0.003 0.003 %
V
OUT
V
OUT
= 10V, f = 120 Hz, C
ADJ
= 0 μF 65 65 dB
Ripple Rejection Ratio
V
OUT
= 10V, f = 120 Hz, C
ADJ
= 10 μF 66 80 66 80 dB
Long-Term Stability T
J
= 125°C, 1000 hrs 0.3 1 0.3 1 %
NDS (TO-3) Package - 2
NDE (TO-220) Package 4 4
KTT (TO-263) Package - 4
Thermal Resistance, θ
JC
°C/W
Junction-to-Case
DCY (SOT-223) Package 23.5 23.5
NDT (TO) Package 21 21
NDP (TO-252) Package 12 12
- 39
NDS (TO-3) Package
50 50
NDE (TO-220) Package
Thermal Resistance, θ
JA
KTT (TO-263) Package
(3)
- 50
Junction-to-Ambient °C/W
DCY (SOT-223) Package
(3)
140 140
(No Heat Sink)
NDT (TO) Package 186 186
NDP (TO-252) Package
(3)
103 103
(1) I
MAX
= 1.5A for the NDS (TO-3), NDE (TO-220), and KTT (TO-263) packages. I
MAX
= 1.0A for the DCY (SOT-223) package. I
MAX
= 0.5A
for the NDT (TO) and NDP (TO-252) packages. Device power dissipation (P
D
) is limited by ambient temperature (T
A
), device maximum
junction temperature (T
J
), and package thermal resistance (θ
JA
). The maximum allowable power dissipation at any temperature is :
P
D(MAX)
= ((T
J(MAX)
- T
A
)/θ
JA
). All Min. and Max. limits are ensured to TI's Average Outgoing Quality Level (AOQL).
(2) Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to
heating effects are covered under the specifications for thermal regulation.
(3) When surface mount packages are used (TO-263, SOT-223, TO-252), the junction to ambient thermal resistance can be reduced by
increasing the PC board copper area that is thermally connected to the package. See the APPLICATION HINTS section for heatsink
techniques.
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