Datasheet

LM2937
SNVS100E –MARCH 2000–REVISED APRIL 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
Continuous 26V
Input Voltage
Transient (t ≤ 100 ms) 60V
Internal Power Dissipation
(3)
Internally Limited
Maximum Junction Temperature 150°C
Storage Temperature Range −65°C to +150°C
TO-220 (10 seconds) 260°C
DDPAK/TO-263 (10 seconds) 230°C
SOT-223 (Vapor Phase, 60 seconds) 215°C
SOT-223 (Infared, 15 seconds) 220°C
ESD Susceptibility
(4)
2 kV
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when
operating the device outside of its rated Operating Conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The maximum allowable power dissipation at any ambient temperature is P
MAX
= (125 − T
A
)/θ
JA
, where 125 is the maximum junction
temperature for operation, T
A
is the ambient temperature, and θ
JA
is the junction-to-ambient thermal resistance. If this dissipation is
exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above
150°C, the LM2937 will go into thermal shutdown. For the LM2937, the junction-to-ambient thermal resistance θ
JA
is 65°C/W, for the
TO-220 package, 73°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. When used with a heatsink, θ
JA
is
the sum of the LM2937 junction-to-case thermal resistance θ
JC
of 3°C/W and the heatsink case-to-ambient thermal resistance. If the
DDPAK/TO-263 or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area
thermally connected to the package (see Application Hints for more information on heatsinking).
(4) ESD rating is based on the human body model, 100 pF discharged through 1.5 kΩ.
Operating Conditions
(1)
LM2937ET, LM2937ES −40°C ≤ T
J
≤125°C
Temperature Range
(2)
LM2937IMP −40°C ≤ T
J
≤85°C
Maximum Input Voltage 26V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when
operating the device outside of its rated Operating Conditions.
(2) The maximum allowable power dissipation at any ambient temperature is P
MAX
= (125 − T
A
)/θ
JA
, where 125 is the maximum junction
temperature for operation, T
A
is the ambient temperature, and θ
JA
is the junction-to-ambient thermal resistance. If this dissipation is
exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above
150°C, the LM2937 will go into thermal shutdown. For the LM2937, the junction-to-ambient thermal resistance θ
JA
is 65°C/W, for the
TO-220 package, 73°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. When used with a heatsink, θ
JA
is
the sum of the LM2937 junction-to-case thermal resistance θ
JC
of 3°C/W and the heatsink case-to-ambient thermal resistance. If the
DDPAK/TO-263 or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area
thermally connected to the package (see Application Hints for more information on heatsinking).
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