Datasheet

LM2937-2.5, LM2937-3.3
SNVS015E –FEBRUARY 1998–REVISED APRIL 2013 www.ti.com
Figure 27. θ
(J−A)
vs Copper (2 ounce) Area for the SOT-223 Package
Figure 28. Maximum Power Dissipation vs T
AMB
for the SOT-223 Package
Please see AN-1028 (SNVA036) for power enhancement techniques to be used with the SOT-223 package.
SOT-223 SOLDERING RECOMMENDATIONS
It is not recommended to use hand soldering or wave soldering to attach the small SOT-223 package to a printed
circuit board. The excessive temperatures involved may cause package cracking.
Either vapor phase or infrared reflow techniques are preferred soldering attachment methods for the SOT-223
package.
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