Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM239ADRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM239A
LM239ADRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM239A
LM239AN OBSOLETE PDIP N 14 TBD Call TI Call TI -25 to 85
LM239D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM239
LM239DE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM239
LM239DG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM239
LM239DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN Level-1-260C-UNLIM -25 to 85 LM239
LM239DRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM239
LM239DRG3 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -25 to 85 LM239
LM239DRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM239
LM239N ACTIVE PDIP N 14 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -25 to 85 LM239N
LM239NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -25 to 85 LM239N
LM239PW ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 L239
LM239PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 L239
LM239PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 L239
LM239PWR ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 L239
LM239PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 L239
LM239PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -25 to 85 L239