Datasheet

LM27341, LM27342, LM27341-Q1, LM27342-Q1
www.ti.com SNVS497E –NOVEMBER 2008–REVISED APRIL 2013
Absolute Maximum Ratings
(1)(2)
AVIN, PVIN -0.5V to 24V
SW Voltage -0.5V to 24V
Boost Voltage -0.5V to 28V
Boost to SW Voltage -0.5V to 6.0V
FB Voltage -0.5V to 3.0V
SYNC Voltage -0.5V to 6.0V
EN Voltage -0.5V to (V
IN
+ 0.3V)
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
ESD Susceptibility
(3)
2kV
Soldering Information Infrared Reflow (5sec) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the recommended Operating Ratings is not implied. The recommended Operating Ratings
indicate conditions at which the device is functional and should not be operated beyond such conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human body model, 1.5 kΩ in series with 100 pF.
Operating Ratings
(1)
AVIN, PVIN 3V to 20V
SW Voltage -0.5V to 20V
Boost Voltage -0.5V to 24V
Boost to SW Voltage 3.0V to 5.5V
Junction Temperature Range −40°C to +125°C
Thermal Resistance (θ
JA
) SON
(2)
33°C/W
Thermal Resistance (θ
JA
) MSOP-PowerPad
(2)
45°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the recommended Operating Ratings is not implied. The recommended Operating Ratings
indicate conditions at which the device is functional and should not be operated beyond such conditions.
(2) Thermal shutdown will occur if the junction temperature exceeds 165°C. The maximum power dissipation is a function of T
J(MAX)
, θ
JA
and T
A
. The maximum allowable power dissipation at any ambient temperature is P
D
= (T
J(MAX)
– T
A
)/θ
JA
. All numbers apply for
packages soldered directly onto a 3” x 3” PC board with 2oz. copper on 4 layers in still air.
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Product Folder Links: LM27341 LM27342 LM27341-Q1 LM27342-Q1