Datasheet
LM2586
SNVS121D –MAY 1996–REVISED APRIL 2013
www.ti.com
LM2586-ADJ (continued)
Symbol Parameters Conditions Typical Min Max Units
I
CL
NPN Switch Current Limit 4.0 3.0 7.0 A
V
STH
Synchronization F
SYNC
= 200 kHz
0.75 0.625/0.40 0.875/1.00 V
Threshold Voltage V
COMP
= 1V, V
IN
= 5V
I
SYNC
Synchronization V
IN
= 5V
100 200 μA
Pin Current V
COMP
= 1V, V
SYNC
= V
STH
V
SHTH
ON/OFF Pin (Pin 1) V
COMP
= 1V
1.6 1.0/0.8 2.2/2.4 V
Threshold Voltage
(7)
I
SH
ON/OFF Pin (Pin 1) V
COMP
= 1V
40 15/10 65/75 μA
Current V
SH
= V
SHTH
θ
JA
Thermal Resistance NDZ Package, Junction to 65
Ambient
(8)
θ
JA
NDZ Package, Junction to 45
Ambient
(9)
θ
JC
NDZ Package, Junction to Case 2
θ
JA
KTW Package, Junction to 56
°C/W
Ambient
(10)
θ
JA
KTW Package, Junction to 35
Ambient
(11)
θ
JA
KTW Package, Junction to 26
Ambient
(12)
θ
JC
KTW Package, Junction to Case 2
(7) When testing the minimum value, do not sink current from this pin—isolate it with a diode. If current is drawn from this pin, the frequency
adjust circuit will begin operation (Figure 55).
(8) Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads in a
socket, or on a PC board with minimum copper area.
(9) Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads
soldered to a PC board containing approximately 4 square inches of (1 oz.) copper area surrounding the leads.
(10) Junction to ambient thermal resistance for the 7 lead DDPAK mounted horizontally against a PC board area of 0.136 square inches (the
same size as the DDPAK package) of 1 oz. (0.0014 in. thick) copper.
(11) Junction to ambient thermal resistance for the 7 lead DDPAK mounted horizontally against a PC board area of 0.4896 square inches
(3.6 times the area of the DDPAK package) of 1 oz. (0.0014 in. thick) copper.
(12) Junction to ambient thermal resistance for the 7 lead DDPAK mounted horizontally against a PC board copper area of 1.0064 square
inches (7.4 times the area of the DDPAK package) of 1 oz. (0.0014 in. thick) copper. Additional copper area will reduce thermal
resistance further. See the thermal model in Switchers Made Simple
®
software.
6 Submit Documentation Feedback Copyright © 1996–2013, Texas Instruments Incorporated
Product Folder Links: LM2586