Datasheet

LM2585
SNVS120F –APRIL 2000–REVISED APRIL 2013 www.ti.com
Electrical Characteristics (All Versions) (continued)
Symbol Parameters Conditions Typical Min Max Units
θ
JA
DDPAK/TO-263 Package, 26
Junction to Ambient
(9)
θ
JC
DDPAK/TO-263 Package, 2
Junction to Case
(9) Junction to ambient thermal resistance for the 5 lead TO-263 mounted horizontally against a PC board copper area of 1.0064 square
inches (7.4 times the area of the DDPAK/TO-2633 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area will reduce
thermal resistance further. See the thermal model in Switchers Made Simple™ software.
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