Datasheet

Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
LM2575SX-3.3/NOPB DDPAK/
TO-263
KTT 5 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2
LM2575SX-5.0 DDPAK/
TO-263
KTT 5 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2
LM2575SX-5.0/NOPB DDPAK/
TO-263
KTT 5 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2
LM2575SX-ADJ DDPAK/
TO-263
KTT 5 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2
LM2575SX-ADJ/NOPB DDPAK/
TO-263
KTT 5 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM2575HVMX-5.0/NOPB SOIC DW 24 1000 367.0 367.0 45.0
LM2575HVSX-15/NOPB DDPAK/TO-263 KTT 5 500 367.0 367.0 45.0
LM2575HVSX-3.3/NOPB DDPAK/TO-263 KTT 5 500 367.0 367.0 45.0
LM2575HVSX-5.0 DDPAK/TO-263 KTT 5 500 367.0 367.0 45.0
LM2575HVSX-5.0/NOPB DDPAK/TO-263 KTT 5 500 367.0 367.0 45.0
LM2575HVSX-ADJ DDPAK/TO-263 KTT 5 500 367.0 367.0 45.0
LM2575HVSX-ADJ/NOPB DDPAK/TO-263 KTT 5 500 367.0 367.0 45.0
LM2575MX-5.0/NOPB SOIC DW 24 1000 367.0 367.0 45.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 2